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Mostrati risultati da 9.241 a 9.260 di 9.882
Titolo Data di pubblicazione Autore(i) File
Three Dimensional Model for Conductive Enclosures with Apertures and Attached Cables 1-gen-1999 Antonini, Giulio; Cristina, S; Orlandi, Antonio
THREE-BAND ANTENNA FOR MICROWAVE RADIOMETRY OF BREAST 1-gen-2005 Bardati, F.; DE SANTIS, F.; Marrocco, G.; Tognolatti, Piero
Three-Dimensional FEM Approach to Model Twisted Wire Pair Cables 1-gen-2007 Buccella, Concettina; Feliziani, Mauro; Manzi, G.
Three-Dimensional FEM Approach to Model Twisted Wire Pair Cables 1-gen-2006 Buccella, Concettina; Feliziani, Mauro; Manzi, G.
Three-Dimensional Non-Destructive Inspection Using Novel Infrared-Terahertz Fusion Approaches † 1-gen-2021 Hu, J.; Zhang, H.; Sfarra, S.; Santulli, C.; Maldague, X.
Three-dimensional optical profilometry for artwork inspection 1-gen-2000 SCHIRRIPA SPAGNOLO, G.; Guattari, G.; Sapia, C.; Ambrosini, Dario; Paoletti, Domenica; Accardo, G.
Three-Phase Induction Motor Efficiency Improvements with Die-Cast Copper Rotor Cage and Premium Steel 1-gen-2004 PARASILITI COLLAZZO, Francesco; Villani, Marco; C., Paris; O., Walti; G., Songini; A., Novello; T., Rossi
Three‑Dimensional Analysis of Porosity in As‑Manufactured Glass Fiber/Vinyl Ester Filament Winded Composites Using X‑Ray Micro‑Computed Tomography 1-gen-2023 Stamopoulos, Antonios; Srivastava, Chaman; Agostino, Pietro; Alcock, Ben; Strandlie, Are; Grammatikos, Sotirios
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 1-gen-2017 Jung, D. H.; Kim, Y.; Kim, J. J.; Kim, H.; Choi, S.; Song, Y. -H.; Bae, H. -C.; Choi, K. -S.; Piersanti, S.; De Paulis, F.; Orlandi, A.; Kim, J.
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 1-gen-2015 Piersanti, Stefano; de Paulis, Francesco; Orlandi, Antonio; Kim, D. H.; Cho, J.; Kim, J.
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 1-gen-2017 Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jonghyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; Kim, Jonghoon J.; Piersanti, Stefano; DE PAULIS, Francesco; Orlandi, Antonio; Kim, Joungho
THz VCO Signal Source Realization in SiGe 130nm BiCMOS 1-gen-2019 Bello, H.; Pantoli, L.; Ng, H. J.; Kissinger, D.; Leuzzi, G.
Tildrakizumab for treatment of moderate to severe psoriasis: an expert opinion of efficacy, safety, and use in special populations 1-gen-2022 Galluzzo, M.; Chiricozzi, A.; Cinotti, E.; Brunasso, G.; Congedo, M.; Esposito, M.; Franchi, C.; Malara, G.; Narcisi, A.; Piaserico, S.; Tiberio, R.; Argenziano, G.; Fabbrocini, G.; Parodi, A.
Time Continuous VCII-Based Fully Analog Interface for Differential Capacitive Sensors 1-gen-2023 Barile, G.; Ferri, G.; Stornelli, V.; Ragnoli, M.; Depari, A.; Flammini, A.; Sisinni, E.
Time domain analysis of lossy shielded cables by CAD circuit simulators 1-gen-2004 Caniggia, S.; Feliziani, Mauro; Manzi, G.; Maradei, F.
Time Domain Analysis of PEEC Models Through the FFT Acceleration Technique 1-gen-2023 Pettanice, G.; Loreto, F.; Valentini, R.; Di Marco, P.; Antonini, G.
Time Domain Computation of Full-Wave Partial Inductances Based on the Numerical Inversion of Laplace Transform Method 1-gen-2021 Loreto, F.; Romano, D.; Antonini, G.; Stumpf, M.; Ruehli, A. E.
Time Domain Iterative Methods for Inhomogeneous and Non-Linear Wave Equations in Lossy Media 1-gen-1996 Buccella, Concettina; Orlandi, Antonio
Time Domain Modeling of Lossy and Dipersive Thin Layers 1-gen-2007 Antonini, Giulio; Orlandi, Antonio
Time domain Modeling of lossy and dispersive thin layers 1-gen-2007 Antonini, Giulio; Orlandi, Antonio
Mostrati risultati da 9.241 a 9.260 di 9.882
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