Sfoglia per Afferenza Dipartimento di Ingegneria industriale e dell'informazione e di economia
THREE-BAND ANTENNA FOR MICROWAVE RADIOMETRY OF BREAST
2005-01-01 Bardati, F.; DE SANTIS, F.; Marrocco, G.; Tognolatti, Piero
Three-Degree-of-Freedom Cable-Driven Parallel Manipulator with Self-Sensing Nitinol Actuators
2024-01-01 Durante, F.; Raparelli, T.; Beomonte Zobel, P.
Three-dimensional computational fluid-dynamic simulation of polypropylene steam gasification
2024-01-01 Vitale, Armando; Papa, Alessandro Antonio; Di Carlo, Andrea; Rapagnà, Sergio
Three-Dimensional FEM Approach to Model Twisted Wire Pair Cables
2007-01-01 Buccella, Concettina; Feliziani, Mauro; Manzi, G.
Three-Dimensional FEM Approach to Model Twisted Wire Pair Cables
2006-01-01 Buccella, Concettina; Feliziani, Mauro; Manzi, G.
Three-Dimensional Non-Destructive Inspection Using Novel Infrared-Terahertz Fusion Approaches †
2021-01-01 Hu, J.; Zhang, H.; Sfarra, S.; Santulli, C.; Maldague, X.
Three-dimensional optical profilometry for artwork inspection
2000-01-01 SCHIRRIPA SPAGNOLO, G.; Guattari, G.; Sapia, C.; Ambrosini, Dario; Paoletti, Domenica; Accardo, G.
Three-Phase Induction Motor Efficiency Improvements with Die-Cast Copper Rotor Cage and Premium Steel
2004-01-01 PARASILITI COLLAZZO, Francesco; Villani, Marco; C., Paris; O., Walti; G., Songini; A., Novello; T., Rossi
Three‑Dimensional Analysis of Porosity in As‑Manufactured Glass Fiber/Vinyl Ester Filament Winded Composites Using X‑Ray Micro‑Computed Tomography
2023-01-01 Stamopoulos, Antonios; Srivastava, Chaman; Agostino, Pietro; Alcock, Ben; Strandlie, Are; Grammatikos, Sotirios
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis
2017-01-01 Jung, D. H.; Kim, Y.; Kim, J. J.; Kim, H.; Choi, S.; Song, Y. -H.; Bae, H. -C.; Choi, K. -S.; Piersanti, S.; De Paulis, F.; Orlandi, A.; Kim, J.
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance
2015-01-01 Piersanti, Stefano; de Paulis, Francesco; Orlandi, Antonio; Kim, D. H.; Cho, J.; Kim, J.
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC
2017-01-01 Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jonghyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; Kim, Jonghoon J.; Piersanti, Stefano; DE PAULIS, Francesco; Orlandi, Antonio; Kim, Joungho
THz VCO Signal Source Realization in SiGe 130nm BiCMOS
2019-01-01 Bello, H.; Pantoli, L.; Ng, H. J.; Kissinger, D.; Leuzzi, G.
Tildrakizumab for treatment of moderate to severe psoriasis: an expert opinion of efficacy, safety, and use in special populations
2022-01-01 Galluzzo, M.; Chiricozzi, A.; Cinotti, E.; Brunasso, G.; Congedo, M.; Esposito, M.; Franchi, C.; Malara, G.; Narcisi, A.; Piaserico, S.; Tiberio, R.; Argenziano, G.; Fabbrocini, G.; Parodi, A.
Time Continuous VCII-Based Fully Analog Interface for Differential Capacitive Sensors
2023-01-01 Barile, G.; Ferri, G.; Stornelli, V.; Ragnoli, M.; Depari, A.; Flammini, A.; Sisinni, E.
Time domain analysis of lossy shielded cables by CAD circuit simulators
2004-01-01 Caniggia, S.; Feliziani, Mauro; Manzi, G.; Maradei, F.
Time Domain Analysis of PEEC Models Through the FFT Acceleration Technique
2023-01-01 Pettanice, G.; Loreto, F.; Valentini, R.; Di Marco, P.; Antonini, G.
Time Domain Assessment of Minimum FEXT by Tabbed Line Design
2024-01-01 de Paulis, F.; Olivieri, C.; Pali, A.
Time Domain Computation of Full-Wave Partial Inductances Based on the Numerical Inversion of Laplace Transform Method
2021-01-01 Loreto, F.; Romano, D.; Antonini, G.; Stumpf, M.; Ruehli, A. E.
Time Domain Iterative Methods for Inhomogeneous and Non-Linear Wave Equations in Lossy Media
1996-01-01 Buccella, Concettina; Orlandi, Antonio
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| THREE-BAND ANTENNA FOR MICROWAVE RADIOMETRY OF BREAST | 1-gen-2005 | Bardati, F.; DE SANTIS, F.; Marrocco, G.; Tognolatti, Piero | |
| Three-Degree-of-Freedom Cable-Driven Parallel Manipulator with Self-Sensing Nitinol Actuators | 1-gen-2024 | Durante, F.; Raparelli, T.; Beomonte Zobel, P. | |
| Three-dimensional computational fluid-dynamic simulation of polypropylene steam gasification | 1-gen-2024 | Vitale, Armando; Papa, Alessandro Antonio; Di Carlo, Andrea; Rapagnà, Sergio | |
| Three-Dimensional FEM Approach to Model Twisted Wire Pair Cables | 1-gen-2007 | Buccella, Concettina; Feliziani, Mauro; Manzi, G. | |
| Three-Dimensional FEM Approach to Model Twisted Wire Pair Cables | 1-gen-2006 | Buccella, Concettina; Feliziani, Mauro; Manzi, G. | |
| Three-Dimensional Non-Destructive Inspection Using Novel Infrared-Terahertz Fusion Approaches † | 1-gen-2021 | Hu, J.; Zhang, H.; Sfarra, S.; Santulli, C.; Maldague, X. | |
| Three-dimensional optical profilometry for artwork inspection | 1-gen-2000 | SCHIRRIPA SPAGNOLO, G.; Guattari, G.; Sapia, C.; Ambrosini, Dario; Paoletti, Domenica; Accardo, G. | |
| Three-Phase Induction Motor Efficiency Improvements with Die-Cast Copper Rotor Cage and Premium Steel | 1-gen-2004 | PARASILITI COLLAZZO, Francesco; Villani, Marco; C., Paris; O., Walti; G., Songini; A., Novello; T., Rossi | |
| Three‑Dimensional Analysis of Porosity in As‑Manufactured Glass Fiber/Vinyl Ester Filament Winded Composites Using X‑Ray Micro‑Computed Tomography | 1-gen-2023 | Stamopoulos, Antonios; Srivastava, Chaman; Agostino, Pietro; Alcock, Ben; Strandlie, Are; Grammatikos, Sotirios | |
| Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis | 1-gen-2017 | Jung, D. H.; Kim, Y.; Kim, J. J.; Kim, H.; Choi, S.; Song, Y. -H.; Bae, H. -C.; Choi, K. -S.; Piersanti, S.; De Paulis, F.; Orlandi, A.; Kim, J. | |
| Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance | 1-gen-2015 | Piersanti, Stefano; de Paulis, Francesco; Orlandi, Antonio; Kim, D. H.; Cho, J.; Kim, J. | |
| Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC | 1-gen-2017 | Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jonghyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; Kim, Jonghoon J.; Piersanti, Stefano; DE PAULIS, Francesco; Orlandi, Antonio; Kim, Joungho | |
| THz VCO Signal Source Realization in SiGe 130nm BiCMOS | 1-gen-2019 | Bello, H.; Pantoli, L.; Ng, H. J.; Kissinger, D.; Leuzzi, G. | |
| Tildrakizumab for treatment of moderate to severe psoriasis: an expert opinion of efficacy, safety, and use in special populations | 1-gen-2022 | Galluzzo, M.; Chiricozzi, A.; Cinotti, E.; Brunasso, G.; Congedo, M.; Esposito, M.; Franchi, C.; Malara, G.; Narcisi, A.; Piaserico, S.; Tiberio, R.; Argenziano, G.; Fabbrocini, G.; Parodi, A. | |
| Time Continuous VCII-Based Fully Analog Interface for Differential Capacitive Sensors | 1-gen-2023 | Barile, G.; Ferri, G.; Stornelli, V.; Ragnoli, M.; Depari, A.; Flammini, A.; Sisinni, E. | |
| Time domain analysis of lossy shielded cables by CAD circuit simulators | 1-gen-2004 | Caniggia, S.; Feliziani, Mauro; Manzi, G.; Maradei, F. | |
| Time Domain Analysis of PEEC Models Through the FFT Acceleration Technique | 1-gen-2023 | Pettanice, G.; Loreto, F.; Valentini, R.; Di Marco, P.; Antonini, G. | |
| Time Domain Assessment of Minimum FEXT by Tabbed Line Design | 1-gen-2024 | de Paulis, F.; Olivieri, C.; Pali, A. | |
| Time Domain Computation of Full-Wave Partial Inductances Based on the Numerical Inversion of Laplace Transform Method | 1-gen-2021 | Loreto, F.; Romano, D.; Antonini, G.; Stumpf, M.; Ruehli, A. E. | |
| Time Domain Iterative Methods for Inhomogeneous and Non-Linear Wave Equations in Lossy Media | 1-gen-1996 | Buccella, Concettina; Orlandi, Antonio |
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