ABSTRACT. Micromachining of silicon plays an important role in the development of devices for optoelectronics and micro electromechanical systems (MEMS) applications. Micromachining of silicon can be realized by several modes, such as electron beam lithography (EBL), reactive ion dry etching (RIE), diamond tools (silicon cutting), and now by laser. The principal problem related with silicon cutting is crack formation near the cutting zone and the low speed of the cutting process. In this paper a new application is presented, i.e. high speed silicon laser cutting. A 355 nm third harmonic Nd:YAG laser was employed to cut silicon in a process conducted in air. In this paper an investigation on the dimension of cuts, laser induced thermal damage, re-deposition of material and micro-cracking arising near the cutting region as a function of laser cutting parameters is reported.
Investigation on High Speed Laser Cutting of Monocrystalline Silicon
DI ILIO, Antoniomaria;
2008-01-01
Abstract
ABSTRACT. Micromachining of silicon plays an important role in the development of devices for optoelectronics and micro electromechanical systems (MEMS) applications. Micromachining of silicon can be realized by several modes, such as electron beam lithography (EBL), reactive ion dry etching (RIE), diamond tools (silicon cutting), and now by laser. The principal problem related with silicon cutting is crack formation near the cutting zone and the low speed of the cutting process. In this paper a new application is presented, i.e. high speed silicon laser cutting. A 355 nm third harmonic Nd:YAG laser was employed to cut silicon in a process conducted in air. In this paper an investigation on the dimension of cuts, laser induced thermal damage, re-deposition of material and micro-cracking arising near the cutting region as a function of laser cutting parameters is reported.Pubblicazioni consigliate
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