Full-Wave Modeling of Via Holes and Equivalent Circuit Extraction for Signal Integrity Analysis

A Finite Integration Technique based method is used for estimating the equivalent circuit of a single via hole in a multilayer board. The via is partitioned in elementary structures, and the scattering parameters are numerically evaluated for each elementary structure. This approach is validated by comparison with other calculated or measured results. Then, an equivalent circuit is extracted for each partition and the cascade of them gives rise to the final equivalent network. The influence of some geometric parameters of a realistic via on its equivalent circuit elements and its electrical performance is investigated.