PIERSANTI, STEFANO
 Distribuzione geografica
Continente #
NA - Nord America 1.084
EU - Europa 660
AS - Asia 530
SA - Sud America 53
Continente sconosciuto - Info sul continente non disponibili 38
AF - Africa 7
OC - Oceania 5
Totale 2.377
Nazione #
US - Stati Uniti d'America 1.060
SG - Singapore 235
IE - Irlanda 157
CN - Cina 131
NL - Olanda 105
RU - Federazione Russa 101
IT - Italia 89
TR - Turchia 57
DE - Germania 53
BR - Brasile 41
HK - Hong Kong 41
SE - Svezia 35
VN - Vietnam 35
UA - Ucraina 34
GB - Regno Unito 30
FR - Francia 21
FI - Finlandia 17
CA - Canada 12
AR - Argentina 7
IN - India 7
MX - Messico 7
JP - Giappone 6
PL - Polonia 6
AU - Australia 5
KR - Corea 5
BD - Bangladesh 4
BE - Belgio 4
KE - Kenya 3
ZA - Sudafrica 3
EC - Ecuador 2
ES - Italia 2
GT - Guatemala 2
JO - Giordania 2
OM - Oman 2
PK - Pakistan 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AT - Austria 1
AZ - Azerbaigian 1
BG - Bulgaria 1
CH - Svizzera 1
CL - Cile 1
CR - Costa Rica 1
DO - Repubblica Dominicana 1
EU - Europa 1
HU - Ungheria 1
IQ - Iraq 1
MD - Moldavia 1
PE - Perù 1
RS - Serbia 1
SN - Senegal 1
TT - Trinidad e Tobago 1
TW - Taiwan 1
VE - Venezuela 1
Totale 2.341
Città #
Dublin 157
Chandler 138
Jacksonville 132
Singapore 117
Amsterdam 104
San Jose 94
Dallas 83
Ashburn 74
Santa Clara 49
Council Bluffs 44
Hong Kong 41
Izmir 39
New York 37
Boardman 34
Nanjing 30
The Dalles 26
Lawrence 19
Moscow 19
Beijing 18
Princeton 18
L'aquila 16
Wilmington 15
Ann Arbor 12
San Mateo 12
Helsinki 10
Ho Chi Minh City 10
Lauterbourg 10
Milan 10
Nanchang 10
Rome 9
Los Angeles 8
Shenyang 8
Hanoi 7
Munich 7
Seattle 7
Woodbridge 7
Orem 6
Tianjin 6
Atlanta 5
Changsha 5
Chicago 5
Phoenix 5
San Francisco 5
Shanghai 5
Warsaw 5
Berlin 4
Brussels 4
Columbus 4
Frankfurt am Main 4
Houston 4
Jinan 4
London 4
Manchester 4
Montreal 4
Rolla 4
Stockholm 4
São Paulo 4
Toronto 4
Verona 4
Zhengzhou 4
Cervaro 3
Chennai 3
Dearborn 3
Guangzhou 3
Haiphong 3
Harbin 3
Kitzingen 3
Kunming 3
Naples 3
Tokyo 3
Vasto 3
Washington 3
Amman 2
Bari 2
Bologna 2
Boston 2
Brooklyn 2
Deltona 2
Falkenstein 2
Florence 2
Guatemala City 2
Hokuto 2
Johannesburg 2
Jundiaí 2
Lanzhou 2
Melbourne 2
Montesilvano Marina 2
Norwalk 2
Poplar 2
Seeb 2
Turin 2
Afragola 1
Agrolândia 1
Ankara 1
Anápolis 1
Apodaca 1
Arezzo 1
Atibaia 1
Aydin 1
Baghdad 1
Totale 1.621
Nome #
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 171
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 162
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 159
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 150
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 148
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 144
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 140
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 138
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 137
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 135
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 128
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 124
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 118
Impact of chip and interposer PDN to eye diagram in high speed channels 116
Near Field Shielding Performances of EMI Noise Suppression Absorbers 113
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 103
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 100
Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer 91
Totale 2.377
Categoria #
all - tutte 9.810
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 9.810


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/202276 0 0 0 3 6 0 6 3 5 2 12 39
2022/2023396 21 31 3 33 38 33 2 30 189 1 6 9
2023/202487 15 5 3 3 7 37 0 2 3 1 1 10
2024/2025366 9 11 41 22 35 20 37 25 104 4 37 21
2025/2026785 45 80 49 60 87 63 94 17 146 95 44 5
2026/2027137 17 28 51 41 0 0 0 0 0 0 0 0
Totale 2.377