PIERSANTI, STEFANO
 Distribuzione geografica
Continente #
NA - Nord America 1.012
EU - Europa 620
AS - Asia 527
SA - Sud America 50
Continente sconosciuto - Info sul continente non disponibili 38
AF - Africa 6
OC - Oceania 5
Totale 2.258
Nazione #
US - Stati Uniti d'America 992
SG - Singapore 235
IE - Irlanda 157
CN - Cina 130
NL - Olanda 105
RU - Federazione Russa 101
TR - Turchia 57
DE - Germania 53
IT - Italia 49
HK - Hong Kong 41
BR - Brasile 38
SE - Svezia 35
VN - Vietnam 35
UA - Ucraina 34
GB - Regno Unito 30
FR - Francia 21
FI - Finlandia 17
CA - Canada 10
AR - Argentina 7
IN - India 7
MX - Messico 7
PL - Polonia 6
AU - Australia 5
KR - Corea 5
BD - Bangladesh 4
BE - Belgio 4
JP - Giappone 4
KE - Kenya 3
EC - Ecuador 2
ES - Italia 2
JO - Giordania 2
OM - Oman 2
PK - Pakistan 2
ZA - Sudafrica 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AT - Austria 1
AZ - Azerbaigian 1
BG - Bulgaria 1
CH - Svizzera 1
CL - Cile 1
CR - Costa Rica 1
DO - Repubblica Dominicana 1
EU - Europa 1
HU - Ungheria 1
IQ - Iraq 1
MD - Moldavia 1
PE - Perù 1
RS - Serbia 1
SN - Senegal 1
TT - Trinidad e Tobago 1
TW - Taiwan 1
VE - Venezuela 1
Totale 2.222
Città #
Dublin 157
Chandler 138
Jacksonville 132
Singapore 117
Amsterdam 104
San Jose 93
Dallas 82
Ashburn 67
Santa Clara 48
Hong Kong 41
Izmir 39
Boardman 34
Nanjing 30
New York 30
Council Bluffs 26
The Dalles 26
Lawrence 19
Moscow 19
Princeton 18
Beijing 17
L'aquila 16
Wilmington 15
Ann Arbor 12
San Mateo 12
Helsinki 10
Ho Chi Minh City 10
Lauterbourg 10
Nanchang 10
Milan 8
Shenyang 8
Hanoi 7
Los Angeles 7
Munich 7
Rome 7
Seattle 7
Woodbridge 7
Orem 6
Tianjin 6
Changsha 5
San Francisco 5
Shanghai 5
Warsaw 5
Atlanta 4
Berlin 4
Brussels 4
Chicago 4
Columbus 4
Frankfurt am Main 4
Houston 4
Jinan 4
London 4
Manchester 4
Rolla 4
Stockholm 4
Toronto 4
Zhengzhou 4
Cervaro 3
Chennai 3
Dearborn 3
Guangzhou 3
Haiphong 3
Harbin 3
Kitzingen 3
Kunming 3
Montreal 3
São Paulo 3
Tokyo 3
Verona 3
Washington 3
Amman 2
Boston 2
Brooklyn 2
Deltona 2
Falkenstein 2
Jundiaí 2
Lanzhou 2
Melbourne 2
Montesilvano Marina 2
Norwalk 2
Phoenix 2
Poplar 2
Seeb 2
Turin 2
Vasto 2
Ankara 1
Anápolis 1
Apodaca 1
Arezzo 1
Atibaia 1
Aydin 1
Baghdad 1
Baku 1
Belgrade 1
Berazategui 1
Bexley 1
Biên Hòa 1
Bragança Paulista 1
Brantford 1
Brisbane 1
Budapest 1
Totale 1.563
Nome #
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 161
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 156
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 150
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 143
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 140
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 137
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 133
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 133
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 127
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 126
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 122
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 120
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 112
Impact of chip and interposer PDN to eye diagram in high speed channels 110
Near Field Shielding Performances of EMI Noise Suppression Absorbers 106
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 98
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 96
Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer 88
Totale 2.258
Categoria #
all - tutte 9.344
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 9.344


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/202291 0 1 14 3 6 0 6 3 5 2 12 39
2022/2023396 21 31 3 33 38 33 2 30 189 1 6 9
2023/202487 15 5 3 3 7 37 0 2 3 1 1 10
2024/2025366 9 11 41 22 35 20 37 25 104 4 37 21
2025/2026785 45 80 49 60 87 63 94 17 146 95 44 5
2026/202718 17 1 0 0 0 0 0 0 0 0 0 0
Totale 2.258