IRIS
ORLANDI, ANTONIO
 Distribuzione geografica
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Continente #
NA - Nord America 12.186
EU - Europa 7.189
AS - Asia 5.113
SA - Sud America 29
Continente sconosciuto - Info sul continente non disponibili 27
OC - Oceania 22
AF - Africa 11
Totale 24.577
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Nazione #
US - Stati Uniti d'America 12.155
IE - Irlanda 2.545
CN - Cina 2.325
TR - Turchia 1.717
IT - Italia 898
DE - Germania 894
SG - Singapore 845
UA - Ucraina 748
GB - Regno Unito 704
SE - Svezia 642
FI - Finlandia 397
FR - Francia 231
IN - India 116
JP - Giappone 37
RU - Federazione Russa 30
BE - Belgio 27
EU - Europa 24
BR - Brasile 22
AU - Australia 21
CA - Canada 20
RO - Romania 20
NL - Olanda 19
KR - Corea 15
HK - Hong Kong 11
TW - Taiwan 10
IL - Israele 9
AT - Austria 8
MX - Messico 7
AE - Emirati Arabi Uniti 4
AL - Albania 4
BD - Bangladesh 4
ES - Italia 4
IR - Iran 4
ZA - Sudafrica 4
HR - Croazia 3
PL - Polonia 3
PT - Portogallo 3
A2 - ???statistics.table.value.countryCode.A2??? 2
CH - Svizzera 2
CL - Cile 2
EC - Ecuador 2
EG - Egitto 2
ID - Indonesia 2
JO - Giordania 2
RS - Serbia 2
SA - Arabia Saudita 2
SC - Seychelles 2
TH - Thailandia 2
AR - Argentina 1
BA - Bosnia-Erzegovina 1
BG - Bulgaria 1
BH - Bahrain 1
BN - Brunei Darussalam 1
BY - Bielorussia 1
CR - Costa Rica 1
DK - Danimarca 1
DO - Repubblica Dominicana 1
GE - Georgia 1
GR - Grecia 1
IQ - Iraq 1
JM - Giamaica 1
KZ - Kazakistan 1
MO - Macao, regione amministrativa speciale della Cina 1
NG - Nigeria 1
NP - Nepal 1
NZ - Nuova Zelanda 1
PA - Panama 1
PE - Perù 1
PH - Filippine 1
SN - Senegal 1
TN - Tunisia 1
VE - Venezuela 1
XK - ???statistics.table.value.countryCode.XK??? 1
Totale 24.577
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Città #
Jacksonville 3.002
Dublin 2.539
Chandler 2.178
Boardman 976
Santa Clara 840
Izmir 831
Singapore 646
Nanjing 614
San Mateo 580
Wilmington 432
Lawrence 387
Princeton 386
Hangzhou 334
L’Aquila 286
New York 278
Nanchang 211
Beijing 189
Milan 188
Shenyang 157
Ann Arbor 151
Ashburn 137
L'aquila 121
Verona 112
Woodbridge 112
Hebei 108
Seattle 102
Mountain View 96
Tianjin 95
Kunming 89
Jiaxing 73
Des Moines 68
Changsha 62
Jinan 61
Norwalk 53
Zhengzhou 53
Shanghai 52
Helsinki 50
Grafing 44
Ningbo 37
Düsseldorf 34
Rome 34
Los Angeles 29
Changchun 27
Brussels 26
Tokyo 25
Guangzhou 24
Lanzhou 21
Venezia 18
Dallas 17
Philadelphia 17
Dearborn 16
Taizhou 15
Houston 14
Timisoara 14
Kitzingen 13
Fremont 11
Toronto 10
Arezzo 9
Pune 9
Taipei 9
Fuzhou 8
San Francisco 8
Bremen 7
Redmond 7
Redwood City 7
Rolla 7
Tappahannock 7
Auburn Hills 6
Bari 6
Melbourne 6
Moscow 6
Mumbai 6
Munich 6
Phoenix 6
Shenzhen 6
Wuhan 6
Amsterdam 5
Berlin 5
Cairo Montenotte 5
Cantalupo In Sabina 5
Hefei 5
Seoul 5
Vienna 5
Walnut 5
Aquila 4
Chengdu 4
Chennai 4
Dubai 4
Edinburgh 4
Falls Church 4
Gloucester 4
North Bergen 4
Paris 4
Sakarya 4
San Jose 4
Vasto 4
Campinas 3
Central 3
Cervaro 3
Chicago 3
Totale 17.327
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Nome #
Causal RLGC(f) Models for Transmission Lines from Measured S-parameters 256
Comparison of Via Equivalent Circuit Models Accuracy Using Quasi-Static and Full-Wave Approaches 203
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 189
5G Over-the-Air Measurement Challenges: Overview 174
A spice model for near-field transient analysis of ferromagnetic grids 170
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 128
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 118
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 109
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 107
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 104
EMC Analysis of Axle Counters in the Italian Railway Network 100
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 100
Equivalent circuit model of a bundle of cables for bulk current injection (BCI) test 93
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 93
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 91
EMC characterization of SMPS devices: Circuit and radiated emissions model 91
Comparison of Data with Multiple Degrees of Freedom Utilizing the Feature Selective Validation (FSV) Method 90
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 89
Nonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling 89
3D PEEC capacitance calculations 89
Analytical integration of quasi-static potential integrals on nonorthogonal coplanar quadrilaterals for the PEEC method 88
De-embedding procedure based on computed/measured data set for PCB structures characterization 88
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 88
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 87
Cavities’ Identification Algorithm for Power Integrity Analysis of Complex Boards 87
S-parameters characterization of through, blind, and buried via holes 85
PCB Interconnect Characterization from S-Parameters Measurements 85
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 85
Planar transmission line method for characterization of printed circuit board dielectrics 85
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 84
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 84
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 83
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 83
Attenuation by Lightning Protection System of Induced Voltages due to Direct Strikes to a Building 83
Two Dimensional EBG Structures for Multiband Noise Mitigation 82
Lightning-induced effects on lossy MTL terminated on arbitrary loads: A wavelet approach 82
Non-orthogonal PEEC formulation for time and frequency domain modeling 81
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 81
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 81
EMC Characterization of SMPS Devices: Circuit Model and Analysis of Radiated Emissions 81
Two-Dimensional FDTD Analysis for Ionized Electromagnetic Fields 80
EMI Due To Near Field in an Air-Insulated Substation 80
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 80
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 80
A Preliminary Study of a Reverberation Chamber Method for Multiple Source Testing Using Intermodulation 79
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 79
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 79
Reconfigurable photoinduced metamaterials in the microwave regime 79
Wide-band Lorentzian media in the FDTD algorithm 79
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 79
Internal stirring: an approach to approximate evaluation of shielding effectiveness of small slotted enclosures 79
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 79
Practical EBG application to multilayer PCB: impact on power integrity 78
Characterization of via holes discontinuities by means of numerical de-embedding 78
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 78
A multilayer removable EBG based common mode filter for high speed buses 78
Equivalent network synthesis for via holes discontinuities 78
Multipath Effects in Semi-Anechoic Chambers at Low Frequencies: A Simplified Prediction Model Based on Image Theory 78
Constrained Decision Planning Applied to Field Profile Optimization in LPS of Structures Directly Struck by Lightning 77
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 77
Extension of the Unmatched-Media Time Reversal Method to Locate Soft Faults in Transmission Lines 77
Validation of a Three-Dimensional Transmission Line Matrix (TLM) Model Implementation of a Mode-Stirred Reverberation Chamber 76
Introduction to Special Issue on “Validation of Computational Electromagnetics 76
Systematic approach for the analysis of the electromagnetic environment inside a building during a lightning strike 76
Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation 76
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 76
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 76
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 75
Calculation of the Induced Effects due to a Lightning Stroke 75
General Regression Neural Network Approach to Prediction of Electric Field Level in The Reverberation Chamber 75
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 75
Common Mode Filtering Performances of Planar EBG Structures 75
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 75
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 74
Feature Selective Validation (FSV) for Validation of Computational Electromagnetics (CEM) – Part II: Assessment of FSV Performances 74
Lightning Induced Transient Voltages in Presence of Complex Structures and Non-Linear Loads 74
Optimization Procedure for Removable EBG Common Mode Filter Design 74
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 74
Enhancing feature selective validation (FSV) interpretation of EMC/SI results with grade-spread 74
Feature selective validation (FSV) for validation of computational electromagnetics (CEM). Part I - The FSV method 73
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 73
Reconstruction of dispersive dielectric properties for PCB substrates using a genetic algorithm 73
Analytical Expressions for Current Share by Means of a Lightning Protection System Model 72
3D Analysis for the Design Impact of Cover-Wall Join on enclosure’s Shielding Performances 72
Prediction Model of Transient EM Field Due to Sliding Contact Arcing in Urban Rail Systems 72
A Hybrid Stack-up pf Printed circuit board for High-Speed Networking System 72
Lightning Stroke to a Structure Protection System: Part II: Electromagnetic Fields Analysis 72
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 72
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 72
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 72
Comments on "Internal impedance of conductors of rectangular cross section" - Authors' reply 71
Efficient transient analysis of long lossy shielded cables 71
Comparison of via equivalent circuit model accuracy using quasi-static and full-wave approaches 71
3D modelling and circuit model extraction of vias in multilayer Printed circuit boards 71
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 71
Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling 70
Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions 70
Full-Wave Modeling of Via Holes and Equivalent Circuit Extraction for Signal Integrity Analysis 70
Impact of partial element accuracy on PEEC model stability 70
The Influence of Data Density on the Consistency of Performance of the Feature Selective Validation (FSV) Technique 70
Totale 8.667
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Categoria #
all - tutte 98.965
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 98.965
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20201.941 0 0 0 0 0 413 537 15 435 91 42 408
2020/20213.036 60 379 6 384 379 83 438 8 402 91 737 69
2021/20221.990 74 253 234 82 97 12 77 161 123 85 155 637
2022/20236.835 484 208 110 570 761 727 18 433 3.205 38 172 109
2023/20241.635 505 103 72 281 98 350 27 78 6 35 13 67
2024/20252.320 74 138 906 156 616 430 0 0 0 0 0 0
Totale 24.818