IRIS
ORLANDI, ANTONIO
 Distribuzione geografica
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Continente #
NA - Nord America 17.640
AS - Asia 10.664
EU - Europa 9.963
SA - Sud America 872
AF - Africa 97
Continente sconosciuto - Info sul continente non disponibili 29
OC - Oceania 26
Totale 39.291
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Nazione #
US - Stati Uniti d'America 17.457
SG - Singapore 3.867
CN - Cina 2.823
IE - Irlanda 2.551
TR - Turchia 1.744
RU - Federazione Russa 1.594
IT - Italia 1.061
DE - Germania 1.017
HK - Hong Kong 1.003
GB - Regno Unito 789
UA - Ucraina 761
BR - Brasile 732
VN - Vietnam 660
SE - Svezia 657
FR - Francia 565
FI - Finlandia 425
NL - Olanda 364
IN - India 167
CA - Canada 93
JP - Giappone 91
BD - Bangladesh 68
AR - Argentina 55
MX - Messico 48
IQ - Iraq 43
BE - Belgio 32
PL - Polonia 31
ZA - Sudafrica 31
AU - Australia 24
ES - Italia 24
EU - Europa 24
EC - Ecuador 22
RO - Romania 21
IL - Israele 18
KR - Corea 18
PK - Pakistan 18
VE - Venezuela 18
MA - Marocco 17
SA - Arabia Saudita 15
CO - Colombia 14
AT - Austria 13
AZ - Azerbaigian 12
CL - Cile 12
UZ - Uzbekistan 12
JO - Giordania 11
KE - Kenya 11
TW - Taiwan 11
CR - Costa Rica 10
EG - Egitto 10
PH - Filippine 10
AE - Emirati Arabi Uniti 9
AL - Albania 9
MY - Malesia 9
PE - Perù 9
TN - Tunisia 8
DZ - Algeria 7
IR - Iran 6
JM - Giamaica 6
NP - Nepal 6
OM - Oman 6
CH - Svizzera 5
ID - Indonesia 5
PT - Portogallo 5
PY - Paraguay 5
RS - Serbia 5
UY - Uruguay 5
BY - Bielorussia 4
GT - Guatemala 4
HN - Honduras 4
KZ - Kazakistan 4
LV - Lettonia 4
MD - Moldavia 4
QA - Qatar 4
TH - Thailandia 4
TT - Trinidad e Tobago 4
BA - Bosnia-Erzegovina 3
BG - Bulgaria 3
DO - Repubblica Dominicana 3
HR - Croazia 3
LT - Lituania 3
SN - Senegal 3
SY - Repubblica araba siriana 3
A2 - ???statistics.table.value.countryCode.A2??? 2
CG - Congo 2
GE - Georgia 2
KH - Cambogia 2
LB - Libano 2
MK - Macedonia 2
NI - Nicaragua 2
NO - Norvegia 2
PA - Panama 2
SC - Seychelles 2
SV - El Salvador 2
XK - ???statistics.table.value.countryCode.XK??? 2
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
AO - Angola 1
BB - Barbados 1
BH - Bahrain 1
BN - Brunei Darussalam 1
BS - Bahamas 1
Totale 39.267
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Città #
Jacksonville 3.006
Dublin 2.545
Chandler 2.179
Singapore 2.118
San Jose 1.684
Dallas 1.134
Hong Kong 981
Boardman 976
Santa Clara 928
Izmir 833
Ashburn 719
Nanjing 616
San Mateo 580
The Dalles 452
Council Bluffs 433
Wilmington 432
Lawrence 387
Princeton 386
Moscow 376
New York 368
Amsterdam 345
Hangzhou 334
L’Aquila 314
Lauterbourg 299
Beijing 296
Ho Chi Minh City 222
Nanchang 211
Milan 209
Hanoi 172
Shenyang 157
Ann Arbor 151
L'aquila 121
Verona 112
Woodbridge 112
Seattle 109
Hebei 108
Mountain View 96
Tianjin 96
Los Angeles 90
Kunming 89
Tokyo 74
Des Moines 73
Jiaxing 73
Hefei 72
Frankfurt am Main 64
Changsha 63
Helsinki 62
Jinan 61
São Paulo 57
Shanghai 56
Zhengzhou 56
Rome 55
Norwalk 54
Grafing 44
Columbus 38
Ningbo 37
Munich 35
Chicago 34
Düsseldorf 34
San Francisco 34
Haiphong 32
Orem 31
Brussels 30
Changchun 28
Da Nang 28
Guangzhou 27
Houston 26
Rio de Janeiro 25
Seriate 24
Brooklyn 23
Toronto 23
Montreal 22
Warsaw 22
Baghdad 21
Johannesburg 21
Lanzhou 21
Philadelphia 21
Naples 20
Phoenix 20
Chennai 18
Denver 18
Venezia 18
Atlanta 17
Belo Horizonte 16
Dearborn 16
Stockholm 15
Taizhou 15
Charlotte 14
Dhaka 14
London 14
Manchester 14
Mexico City 14
Timisoara 14
Curitiba 13
Kitzingen 13
Baku 12
Pune 12
Amman 11
Brasília 11
Can Tho 11
Totale 26.617
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Nome #
Causal RLGC(f) Models for Transmission Lines from Measured S-parameters 290
Comparison of Via Equivalent Circuit Models Accuracy Using Quasi-Static and Full-Wave Approaches 241
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 225
A spice model for near-field transient analysis of ferromagnetic grids 218
5G Over-the-Air Measurement Challenges: Overview 207
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 196
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 160
3D PEEC capacitance calculations 157
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 156
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 153
Equivalent circuit model of a bundle of cables for bulk current injection (BCI) test 152
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 150
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 149
Optimization Procedure for Removable EBG Common Mode Filter Design 147
Comparison of Data with Multiple Degrees of Freedom Utilizing the Feature Selective Validation (FSV) Method 145
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 145
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 143
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 141
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 140
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 140
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 137
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 135
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 135
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 133
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 133
Two-Dimensional FDTD Analysis for Ionized Electromagnetic Fields 132
Nonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling 132
Feature selective validation (FSV) for validation of computational electromagnetics (CEM). Part I - The FSV method 132
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 132
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 131
De-embedding procedure based on computed/measured data set for PCB structures characterization 131
EMC Analysis of Axle Counters in the Italian Railway Network 131
Internal stirring: an approach to approximate evaluation of shielding effectiveness of small slotted enclosures 131
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 131
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 130
Cavities’ Identification Algorithm for Power Integrity Analysis of Complex Boards 130
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 130
EMC characterization of SMPS devices: Circuit and radiated emissions model 129
Impact of partial element accuracy on PEEC model stability 129
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 128
S-parameters characterization of through, blind, and buried via holes 127
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 127
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 127
Resonant EBG-Based Common Mode Filter for LTCC Substrates 127
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 127
Feature Selective Validation (FSV) for Validation of Computational Electromagnetics (CEM) – Part II: Assessment of FSV Performances 126
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 126
Reconfigurable photoinduced metamaterials in the microwave regime 125
Wide-band Lorentzian media in the FDTD algorithm 125
Lightning-induced effects on lossy MTL terminated on arbitrary loads: A wavelet approach 125
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 125
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 125
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 125
A multilayer removable EBG based common mode filter for high speed buses 124
An improved method of modeling lossy transmission lines in finite-difference, time-domain analysis 123
Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation 123
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 122
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 122
Validation of a Three-Dimensional Transmission Line Matrix (TLM) Model Implementation of a Mode-Stirred Reverberation Chamber 121
3D Analysis for the Design Impact of Cover-Wall Join on enclosure’s Shielding Performances 121
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 121
Extension of the Unmatched-Media Time Reversal Method to Locate Soft Faults in Transmission Lines 121
Multipath Effects in Semi-Anechoic Chambers at Low Frequencies: A Simplified Prediction Model Based on Image Theory 121
Calculation of the Induced Effects due to a Lightning Stroke 119
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 119
EMC Characterization of SMPS Devices: Circuit Model and Analysis of Radiated Emissions 119
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 119
Planar transmission line method for characterization of printed circuit board dielectrics 119
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 119
Reconstruction of dispersive dielectric properties for PCB substrates using a genetic algorithm 119
Analytical integration of quasi-static potential integrals on nonorthogonal coplanar quadrilaterals for the PEEC method 118
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 118
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 118
Attenuation by Lightning Protection System of Induced Voltages due to Direct Strikes to a Building 117
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 117
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 116
Comparison of via equivalent circuit model accuracy using quasi-static and full-wave approaches 116
Practical EBG application to multilayer PCB: impact on power integrity 116
PEEC modeling of lightning protection systems and coupling to coaxial cables 115
EMI Due To Near Field in an Air-Insulated Substation 115
Validation of equivalent circuits extracted from S-parameter data for eye-pattern evaluation 115
Two Dimensional EBG Structures for Multiband Noise Mitigation 114
3D modelling and circuit model extraction of vias in multilayer Printed circuit boards 114
Systematic approach for the analysis of the electromagnetic environment inside a building during a lightning strike 114
Factors Influencing the Successful Validation of Transient Phenomenon Modelling 114
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 114
A Preliminary Study of a Reverberation Chamber Method for Multiple Source Testing Using Intermodulation 113
Constrained Decision Planning Applied to Field Profile Optimization in LPS of Structures Directly Struck by Lightning 113
Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling 113
Lightning Induced Transient Voltages in Presence of Complex Structures and Non-Linear Loads 112
General Regression Neural Network Approach to Prediction of Electric Field Level in The Reverberation Chamber 112
3D Modeling and Circuit Model Extraction of Vias in Multilayer Printed Circuit Boards 112
PCB Interconnect Characterization from S-Parameters Measurements 112
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 112
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 112
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 112
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 112
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 111
Grounding, unbalancing and length effects on termination voltages of a twinax cable during bulk current injection 111
Comments on "Internal impedance of conductors of rectangular cross section" - Authors' reply 111
Totale 13.195
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Categoria #
all - tutte 163.842
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 163.842
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/20221.990 74 253 234 82 97 12 77 161 123 85 155 637
2022/20236.835 484 208 110 570 761 727 18 433 3.205 38 172 109
2023/20241.635 505 103 72 281 98 350 27 78 6 35 13 67
2024/20256.031 74 138 906 156 616 494 850 560 1.383 160 362 332
2025/202610.839 471 1.182 541 1.186 807 976 2.123 410 1.315 903 745 180
2026/2027178 178 0 0 0 0 0 0 0 0 0 0 0
Totale 39.546