IRIS
ORLANDI, ANTONIO
 Distribuzione geografica
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Continente #
NA - Nord America 17.002
AS - Asia 10.631
EU - Europa 9.895
SA - Sud America 851
AF - Africa 97
Continente sconosciuto - Info sul continente non disponibili 29
OC - Oceania 26
Totale 38.531
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Nazione #
US - Stati Uniti d'America 16.845
SG - Singapore 3.861
CN - Cina 2.817
IE - Irlanda 2.551
TR - Turchia 1.744
RU - Federazione Russa 1.594
DE - Germania 1.017
IT - Italia 1.015
HK - Hong Kong 1.003
GB - Regno Unito 789
UA - Ucraina 761
BR - Brasile 720
VN - Vietnam 658
SE - Svezia 656
FR - Francia 562
FI - Finlandia 425
NL - Olanda 363
IN - India 167
JP - Giappone 91
CA - Canada 80
BD - Bangladesh 54
AR - Argentina 52
MX - Messico 46
IQ - Iraq 43
ZA - Sudafrica 31
BE - Belgio 30
PL - Polonia 29
AU - Australia 24
EU - Europa 24
EC - Ecuador 21
RO - Romania 21
ES - Italia 19
IL - Israele 18
KR - Corea 18
PK - Pakistan 18
VE - Venezuela 18
MA - Marocco 17
SA - Arabia Saudita 15
AT - Austria 13
AZ - Azerbaigian 12
UZ - Uzbekistan 12
CL - Cile 11
CO - Colombia 11
JO - Giordania 11
KE - Kenya 11
TW - Taiwan 11
EG - Egitto 10
AL - Albania 9
PH - Filippine 9
AE - Emirati Arabi Uniti 8
PE - Perù 8
TN - Tunisia 8
CR - Costa Rica 7
DZ - Algeria 7
MY - Malesia 7
IR - Iran 6
NP - Nepal 6
OM - Oman 6
CH - Svizzera 5
ID - Indonesia 5
PT - Portogallo 5
PY - Paraguay 5
RS - Serbia 5
UY - Uruguay 5
BY - Bielorussia 4
JM - Giamaica 4
KZ - Kazakistan 4
QA - Qatar 4
TH - Thailandia 4
DO - Repubblica Dominicana 3
GT - Guatemala 3
HN - Honduras 3
HR - Croazia 3
LT - Lituania 3
MD - Moldavia 3
SN - Senegal 3
SY - Repubblica araba siriana 3
TT - Trinidad e Tobago 3
A2 - ???statistics.table.value.countryCode.A2??? 2
BA - Bosnia-Erzegovina 2
BG - Bulgaria 2
CG - Congo 2
GE - Georgia 2
LB - Libano 2
MK - Macedonia 2
NO - Norvegia 2
PA - Panama 2
SC - Seychelles 2
XK - ???statistics.table.value.countryCode.XK??? 2
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
AO - Angola 1
BB - Barbados 1
BH - Bahrain 1
BN - Brunei Darussalam 1
BS - Bahamas 1
DK - Danimarca 1
DM - Dominica 1
ET - Etiopia 1
GR - Grecia 1
Totale 38.510
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Città #
Jacksonville 3.005
Dublin 2.545
Chandler 2.178
Singapore 2.117
San Jose 1.684
Dallas 1.127
Hong Kong 981
Boardman 976
Santa Clara 898
Izmir 833
Ashburn 675
Nanjing 616
San Mateo 580
The Dalles 452
Wilmington 432
Lawrence 387
Princeton 386
Moscow 376
New York 361
Amsterdam 345
Hangzhou 334
L’Aquila 302
Lauterbourg 299
Beijing 294
Ho Chi Minh City 222
Nanchang 211
Milan 200
Hanoi 171
Shenyang 157
Ann Arbor 151
L'aquila 121
Verona 112
Woodbridge 112
Seattle 109
Hebei 108
Mountain View 96
Tianjin 96
Kunming 89
Los Angeles 88
Tokyo 74
Des Moines 73
Jiaxing 73
Hefei 72
Frankfurt am Main 64
Changsha 63
Helsinki 62
Jinan 61
Council Bluffs 59
Shanghai 56
São Paulo 56
Zhengzhou 56
Norwalk 54
Rome 51
Grafing 44
Ningbo 37
Columbus 36
Munich 35
Düsseldorf 34
San Francisco 34
Haiphong 32
Orem 31
Brussels 29
Chicago 29
Changchun 28
Da Nang 28
Guangzhou 27
Houston 24
Rio de Janeiro 24
Seriate 24
Baghdad 21
Johannesburg 21
Lanzhou 21
Montreal 21
Philadelphia 21
Warsaw 21
Brooklyn 20
Toronto 20
Naples 19
Phoenix 19
Chennai 18
Venezia 18
Belo Horizonte 16
Dearborn 16
Denver 16
Atlanta 15
Stockholm 15
Taizhou 15
Charlotte 14
Dhaka 14
London 14
Manchester 14
Timisoara 14
Curitiba 13
Kitzingen 13
Mexico City 13
Baku 12
Pune 12
Amman 11
Brasília 11
Can Tho 11
Totale 26.095
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Nome #
Causal RLGC(f) Models for Transmission Lines from Measured S-parameters 286
Comparison of Via Equivalent Circuit Models Accuracy Using Quasi-Static and Full-Wave Approaches 240
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 223
A spice model for near-field transient analysis of ferromagnetic grids 217
5G Over-the-Air Measurement Challenges: Overview 204
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 196
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 156
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 154
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 153
Equivalent circuit model of a bundle of cables for bulk current injection (BCI) test 150
3D PEEC capacitance calculations 149
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 149
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 149
Comparison of Data with Multiple Degrees of Freedom Utilizing the Feature Selective Validation (FSV) Method 145
Optimization Procedure for Removable EBG Common Mode Filter Design 145
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 143
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 142
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 141
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 137
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 136
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 135
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 135
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 133
Internal stirring: an approach to approximate evaluation of shielding effectiveness of small slotted enclosures 131
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 131
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 131
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 130
EMC Analysis of Axle Counters in the Italian Railway Network 130
Nonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling 130
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 129
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 129
Two-Dimensional FDTD Analysis for Ionized Electromagnetic Fields 128
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 128
S-parameters characterization of through, blind, and buried via holes 127
De-embedding procedure based on computed/measured data set for PCB structures characterization 127
Feature selective validation (FSV) for validation of computational electromagnetics (CEM). Part I - The FSV method 127
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 127
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 126
EMC characterization of SMPS devices: Circuit and radiated emissions model 126
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 126
Resonant EBG-Based Common Mode Filter for LTCC Substrates 126
Feature Selective Validation (FSV) for Validation of Computational Electromagnetics (CEM) – Part II: Assessment of FSV Performances 125
Cavities’ Identification Algorithm for Power Integrity Analysis of Complex Boards 125
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 125
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 123
Impact of partial element accuracy on PEEC model stability 123
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 123
Lightning-induced effects on lossy MTL terminated on arbitrary loads: A wavelet approach 122
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 122
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 122
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 122
Reconfigurable photoinduced metamaterials in the microwave regime 121
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 121
Wide-band Lorentzian media in the FDTD algorithm 121
Multipath Effects in Semi-Anechoic Chambers at Low Frequencies: A Simplified Prediction Model Based on Image Theory 121
3D Analysis for the Design Impact of Cover-Wall Join on enclosure’s Shielding Performances 120
An improved method of modeling lossy transmission lines in finite-difference, time-domain analysis 120
A multilayer removable EBG based common mode filter for high speed buses 120
Extension of the Unmatched-Media Time Reversal Method to Locate Soft Faults in Transmission Lines 120
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 119
Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation 119
Calculation of the Induced Effects due to a Lightning Stroke 118
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 118
Reconstruction of dispersive dielectric properties for PCB substrates using a genetic algorithm 118
Analytical integration of quasi-static potential integrals on nonorthogonal coplanar quadrilaterals for the PEEC method 117
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 117
Attenuation by Lightning Protection System of Induced Voltages due to Direct Strikes to a Building 117
Comparison of via equivalent circuit model accuracy using quasi-static and full-wave approaches 116
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 116
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 116
Validation of a Three-Dimensional Transmission Line Matrix (TLM) Model Implementation of a Mode-Stirred Reverberation Chamber 115
EMI Due To Near Field in an Air-Insulated Substation 115
Practical EBG application to multilayer PCB: impact on power integrity 115
Planar transmission line method for characterization of printed circuit board dielectrics 115
PEEC modeling of lightning protection systems and coupling to coaxial cables 114
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 114
Validation of equivalent circuits extracted from S-parameter data for eye-pattern evaluation 114
Factors Influencing the Successful Validation of Transient Phenomenon Modelling 114
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 114
Systematic approach for the analysis of the electromagnetic environment inside a building during a lightning strike 113
EMC Characterization of SMPS Devices: Circuit Model and Analysis of Radiated Emissions 113
Constrained Decision Planning Applied to Field Profile Optimization in LPS of Structures Directly Struck by Lightning 112
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 112
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 112
General Regression Neural Network Approach to Prediction of Electric Field Level in The Reverberation Chamber 112
3D Modeling and Circuit Model Extraction of Vias in Multilayer Printed Circuit Boards 112
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 112
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 112
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 111
Lightning Induced Transient Voltages in Presence of Complex Structures and Non-Linear Loads 111
PCB Interconnect Characterization from S-Parameters Measurements 111
A Preliminary Study of a Reverberation Chamber Method for Multiple Source Testing Using Intermodulation 110
Two Dimensional EBG Structures for Multiband Noise Mitigation 110
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 110
Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling 109
3D modelling and circuit model extraction of vias in multilayer Printed circuit boards 109
2D-FDTD Point Value Multiresolution for Maxwell's Equations 109
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 109
Characterization of via holes discontinuities by means of numerical de-embedding 109
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 109
Totale 12.971
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Categoria #
all - tutte 157.878
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 157.878
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021806 0 0 0 0 0 0 0 0 0 0 737 69
2021/20221.990 74 253 234 82 97 12 77 161 123 85 155 637
2022/20236.835 484 208 110 570 761 727 18 433 3.205 38 172 109
2023/20241.635 505 103 72 281 98 350 27 78 6 35 13 67
2024/20256.031 74 138 906 156 616 494 850 560 1.383 160 362 332
2025/202610.253 471 1.182 541 1.186 807 976 2.123 410 1.315 903 339 0
Totale 38.782