ORLANDI, ANTONIO
 Distribuzione geografica
Continente #
NA - Nord America 11.379
EU - Europa 7.168
AS - Asia 4.938
Continente sconosciuto - Info sul continente non disponibili 27
OC - Oceania 22
AF - Africa 9
SA - Sud America 9
Totale 23.552
Nazione #
US - Stati Uniti d'America 11.350
IE - Irlanda 2.545
CN - Cina 2.324
TR - Turchia 1.716
IT - Italia 895
DE - Germania 891
UA - Ucraina 748
GB - Regno Unito 704
SG - Singapore 677
SE - Svezia 642
FI - Finlandia 388
FR - Francia 231
IN - India 116
JP - Giappone 37
RU - Federazione Russa 29
BE - Belgio 27
EU - Europa 24
AU - Australia 21
CA - Canada 20
RO - Romania 20
KR - Corea 15
NL - Olanda 15
HK - Hong Kong 11
TW - Taiwan 10
IL - Israele 9
AT - Austria 8
MX - Messico 7
BR - Brasile 6
AE - Emirati Arabi Uniti 4
AL - Albania 4
ES - Italia 4
BD - Bangladesh 3
HR - Croazia 3
PL - Polonia 3
PT - Portogallo 3
ZA - Sudafrica 3
A2 - ???statistics.table.value.countryCode.A2??? 2
CH - Svizzera 2
CL - Cile 2
EG - Egitto 2
ID - Indonesia 2
IR - Iran 2
RS - Serbia 2
SA - Arabia Saudita 2
SC - Seychelles 2
TH - Thailandia 2
BA - Bosnia-Erzegovina 1
BG - Bulgaria 1
BN - Brunei Darussalam 1
BY - Bielorussia 1
CR - Costa Rica 1
DK - Danimarca 1
GE - Georgia 1
IQ - Iraq 1
JO - Giordania 1
KZ - Kazakistan 1
MO - Macao, regione amministrativa speciale della Cina 1
NG - Nigeria 1
NP - Nepal 1
NZ - Nuova Zelanda 1
PA - Panama 1
PE - Perù 1
PH - Filippine 1
TN - Tunisia 1
XK - ???statistics.table.value.countryCode.XK??? 1
Totale 23.552
Città #
Jacksonville 3.002
Dublin 2.539
Chandler 2.178
Boardman 976
Izmir 831
Nanjing 614
San Mateo 580
Singapore 486
Wilmington 432
Lawrence 387
Princeton 386
Hangzhou 334
L’Aquila 286
New York 278
Nanchang 211
Beijing 189
Milan 188
Shenyang 157
Ann Arbor 151
Ashburn 137
L'aquila 121
Verona 112
Woodbridge 112
Hebei 108
Seattle 102
Mountain View 96
Tianjin 95
Kunming 89
Jiaxing 73
Des Moines 68
Changsha 62
Jinan 61
Santa Clara 54
Norwalk 53
Zhengzhou 53
Shanghai 52
Grafing 44
Helsinki 42
Ningbo 37
Düsseldorf 34
Rome 34
Los Angeles 29
Changchun 27
Brussels 26
Tokyo 25
Guangzhou 24
Lanzhou 21
Venezia 18
Dallas 17
Philadelphia 17
Dearborn 16
Taizhou 15
Houston 14
Timisoara 14
Kitzingen 13
Fremont 11
Toronto 10
Arezzo 9
Pune 9
Taipei 9
Fuzhou 8
San Francisco 8
Bremen 7
Redmond 7
Redwood City 7
Rolla 7
Tappahannock 7
Auburn Hills 6
Bari 6
Melbourne 6
Moscow 6
Mumbai 6
Munich 6
Phoenix 6
Shenzhen 6
Wuhan 6
Amsterdam 5
Berlin 5
Cairo Montenotte 5
Cantalupo In Sabina 5
Hefei 5
Seoul 5
Vienna 5
Walnut 5
Aquila 4
Chengdu 4
Chennai 4
Dubai 4
Edinburgh 4
Falls Church 4
Gloucester 4
North Bergen 4
Paris 4
Sakarya 4
San Jose 4
Vasto 4
Campinas 3
Central 3
Cervaro 3
Chicago 3
Totale 16.373
Nome #
Causal RLGC(f) Models for Transmission Lines from Measured S-parameters 254
Comparison of Via Equivalent Circuit Models Accuracy Using Quasi-Static and Full-Wave Approaches 198
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 186
5G Over-the-Air Measurement Challenges: Overview 171
A spice model for near-field transient analysis of ferromagnetic grids 168
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 125
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 116
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 103
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 102
EMC Analysis of Axle Counters in the Italian Railway Network 98
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 96
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 91
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 91
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 89
Equivalent circuit model of a bundle of cables for bulk current injection (BCI) test 89
EMC characterization of SMPS devices: Circuit and radiated emissions model 89
Comparison of Data with Multiple Degrees of Freedom Utilizing the Feature Selective Validation (FSV) Method 88
Nonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling 87
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 86
Analytical integration of quasi-static potential integrals on nonorthogonal coplanar quadrilaterals for the PEEC method 85
De-embedding procedure based on computed/measured data set for PCB structures characterization 85
Cavities’ Identification Algorithm for Power Integrity Analysis of Complex Boards 85
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 84
S-parameters characterization of through, blind, and buried via holes 83
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 83
PCB Interconnect Characterization from S-Parameters Measurements 83
Planar transmission line method for characterization of printed circuit board dielectrics 83
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 81
Attenuation by Lightning Protection System of Induced Voltages due to Direct Strikes to a Building 81
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 80
3D PEEC capacitance calculations 80
Lightning-induced effects on lossy MTL terminated on arbitrary loads: A wavelet approach 80
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 80
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 80
Two Dimensional EBG Structures for Multiband Noise Mitigation 79
Non-orthogonal PEEC formulation for time and frequency domain modeling 79
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 79
EMC Characterization of SMPS Devices: Circuit Model and Analysis of Radiated Emissions 79
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 78
Two-Dimensional FDTD Analysis for Ionized Electromagnetic Fields 78
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 78
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 78
EMI Due To Near Field in an Air-Insulated Substation 77
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 77
A Preliminary Study of a Reverberation Chamber Method for Multiple Source Testing Using Intermodulation 76
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 76
Wide-band Lorentzian media in the FDTD algorithm 76
Practical EBG application to multilayer PCB: impact on power integrity 76
Characterization of via holes discontinuities by means of numerical de-embedding 76
Internal stirring: an approach to approximate evaluation of shielding effectiveness of small slotted enclosures 76
Equivalent network synthesis for via holes discontinuities 76
Constrained Decision Planning Applied to Field Profile Optimization in LPS of Structures Directly Struck by Lightning 75
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 75
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 75
Multipath Effects in Semi-Anechoic Chambers at Low Frequencies: A Simplified Prediction Model Based on Image Theory 75
Validation of a Three-Dimensional Transmission Line Matrix (TLM) Model Implementation of a Mode-Stirred Reverberation Chamber 74
Introduction to Special Issue on “Validation of Computational Electromagnetics 74
Systematic approach for the analysis of the electromagnetic environment inside a building during a lightning strike 74
Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation 74
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 74
A multilayer removable EBG based common mode filter for high speed buses 74
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 74
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 74
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 73
Calculation of the Induced Effects due to a Lightning Stroke 73
General Regression Neural Network Approach to Prediction of Electric Field Level in The Reverberation Chamber 73
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 73
Common Mode Filtering Performances of Planar EBG Structures 73
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 73
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 72
Feature Selective Validation (FSV) for Validation of Computational Electromagnetics (CEM) – Part II: Assessment of FSV Performances 72
Lightning Induced Transient Voltages in Presence of Complex Structures and Non-Linear Loads 72
Enhancing feature selective validation (FSV) interpretation of EMC/SI results with grade-spread 72
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 71
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 71
Reconfigurable photoinduced metamaterials in the microwave regime 70
Analytical Expressions for Current Share by Means of a Lightning Protection System Model 70
3D Analysis for the Design Impact of Cover-Wall Join on enclosure’s Shielding Performances 70
Prediction Model of Transient EM Field Due to Sliding Contact Arcing in Urban Rail Systems 70
A Hybrid Stack-up pf Printed circuit board for High-Speed Networking System 70
Lightning Stroke to a Structure Protection System: Part II: Electromagnetic Fields Analysis 70
Feature selective validation (FSV) for validation of computational electromagnetics (CEM). Part I - The FSV method 70
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 70
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 70
Reconstruction of dispersive dielectric properties for PCB substrates using a genetic algorithm 70
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 69
Comments on "Internal impedance of conductors of rectangular cross section" - Authors' reply 69
Efficient transient analysis of long lossy shielded cables 69
3D modelling and circuit model extraction of vias in multilayer Printed circuit boards 69
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 69
Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling 68
Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions 68
Comparison of via equivalent circuit model accuracy using quasi-static and full-wave approaches 68
Full-Wave Modeling of Via Holes and Equivalent Circuit Extraction for Signal Integrity Analysis 68
Impact of partial element accuracy on PEEC model stability 68
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 68
Down-sampled and Under-sampled Data sets in Feature Selective Validation (FSV) 67
A new method for transient analysis of high voltage ionized field in two-dimensional domain 67
PEEC Modeling of High Voltage Towers Under Direct and Nearby Lightning Strike 67
Induced potentials inside vessels containing flammable liquids during direct lightning strike 67
Totale 8.355
Categoria #
all - tutte 93.782
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 93.782


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20201.973 0 0 0 0 32 413 537 15 435 91 42 408
2020/20213.036 60 379 6 384 379 83 438 8 402 91 737 69
2021/20221.990 74 253 234 82 97 12 77 161 123 85 155 637
2022/20236.835 484 208 110 570 761 727 18 433 3.205 38 172 109
2023/20241.635 505 103 72 281 98 350 27 78 6 35 13 67
2024/20251.295 74 138 906 156 21 0 0 0 0 0 0 0
Totale 23.793