IRIS
ORLANDI, ANTONIO
 Distribuzione geografica
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Continente #
NA - Nord America 18.313
AS - Asia 10.724
EU - Europa 9.994
SA - Sud America 922
Continente sconosciuto - Info sul continente non disponibili 284
AF - Africa 99
OC - Oceania 26
Totale 40.362
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Nazione #
US - Stati Uniti d'America 18.060
SG - Singapore 3.893
CN - Cina 2.834
IE - Irlanda 2.551
TR - Turchia 1.745
RU - Federazione Russa 1.594
IT - Italia 1.088
DE - Germania 1.018
HK - Hong Kong 1.005
GB - Regno Unito 790
BR - Brasile 778
UA - Ucraina 762
VN - Vietnam 660
SE - Svezia 657
FR - Francia 566
FI - Finlandia 425
NL - Olanda 364
IN - India 167
CA - Canada 148
JP - Giappone 104
BD - Bangladesh 73
AR - Argentina 55
MX - Messico 50
IQ - Iraq 43
BE - Belgio 32
ZA - Sudafrica 32
PL - Polonia 31
AU - Australia 24
ES - Italia 24
EU - Europa 24
EC - Ecuador 22
RO - Romania 21
KR - Corea 19
VE - Venezuela 19
IL - Israele 18
PK - Pakistan 18
MA - Marocco 17
CO - Colombia 16
SA - Arabia Saudita 15
AT - Austria 13
CL - Cile 13
AZ - Azerbaigian 12
UZ - Uzbekistan 12
CR - Costa Rica 11
JO - Giordania 11
KE - Kenya 11
TW - Taiwan 11
EG - Egitto 10
PH - Filippine 10
AE - Emirati Arabi Uniti 9
AL - Albania 9
JM - Giamaica 9
MY - Malesia 9
PE - Perù 9
TN - Tunisia 8
DZ - Algeria 7
TT - Trinidad e Tobago 7
GT - Guatemala 6
IR - Iran 6
NP - Nepal 6
OM - Oman 6
CH - Svizzera 5
HN - Honduras 5
ID - Indonesia 5
PT - Portogallo 5
PY - Paraguay 5
RS - Serbia 5
UY - Uruguay 5
BY - Bielorussia 4
KZ - Kazakistan 4
LV - Lettonia 4
MD - Moldavia 4
QA - Qatar 4
TH - Thailandia 4
BA - Bosnia-Erzegovina 3
BG - Bulgaria 3
DO - Repubblica Dominicana 3
GE - Georgia 3
HR - Croazia 3
LT - Lituania 3
SC - Seychelles 3
SN - Senegal 3
SY - Repubblica araba siriana 3
A2 - ???statistics.table.value.countryCode.A2??? 2
BB - Barbados 2
CG - Congo 2
KH - Cambogia 2
LB - Libano 2
MK - Macedonia 2
NI - Nicaragua 2
NO - Norvegia 2
PA - Panama 2
SV - El Salvador 2
XK - ???statistics.table.value.countryCode.XK??? 2
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
AO - Angola 1
BH - Bahrain 1
BN - Brunei Darussalam 1
BS - Bahamas 1
Totale 40.081
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Città #
Jacksonville 3.007
Dublin 2.545
Chandler 2.179
Singapore 2.130
San Jose 1.723
Dallas 1.139
Hong Kong 982
Boardman 976
Santa Clara 944
Ashburn 940
Izmir 833
Nanjing 616
San Mateo 580
The Dalles 452
Council Bluffs 433
Wilmington 432
New York 397
Lawrence 387
Princeton 386
Moscow 376
Amsterdam 346
Hangzhou 334
L’Aquila 314
Beijing 303
Lauterbourg 299
Ho Chi Minh City 222
Milan 215
Nanchang 211
Hanoi 172
Shenyang 157
Ann Arbor 151
Los Angeles 134
L'aquila 121
Verona 112
Woodbridge 112
Seattle 110
Hebei 108
São Paulo 101
Mountain View 96
Tianjin 96
Kunming 89
Tokyo 74
Des Moines 73
Jiaxing 73
Hefei 72
Frankfurt am Main 65
Changsha 63
Helsinki 62
Jinan 61
Rome 59
Shanghai 57
Zhengzhou 56
Norwalk 54
Toronto 52
Grafing 44
Montreal 41
Columbus 38
Ningbo 37
Chicago 35
Munich 35
San Francisco 35
Düsseldorf 34
Haiphong 32
Phoenix 32
Orem 31
Brussels 30
Houston 30
Changchun 28
Da Nang 28
Guangzhou 27
Philadelphia 25
Rio de Janeiro 25
Seriate 24
Brooklyn 23
Naples 23
Johannesburg 22
Warsaw 22
Baghdad 21
Lanzhou 21
Buffalo 20
Atlanta 19
Piscataway 19
Charlotte 18
Chennai 18
Denver 18
Venezia 18
Belo Horizonte 16
Dearborn 16
Mexico City 16
London 15
Stockholm 15
Taizhou 15
Dhaka 14
Manchester 14
Timisoara 14
Curitiba 13
Hokuto 13
Kitzingen 13
Baku 12
Pune 12
Totale 27.152
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Nome #
Causal RLGC(f) Models for Transmission Lines from Measured S-parameters 290
S-parameters characterization of through, blind, and buried via holes 241
Comparison of Via Equivalent Circuit Models Accuracy Using Quasi-Static and Full-Wave Approaches 241
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 226
A spice model for near-field transient analysis of ferromagnetic grids 218
5G Over-the-Air Measurement Challenges: Overview 208
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 197
3D PEEC capacitance calculations 162
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 161
Identification of Jiles-Atherton Model Parameters for Circuit Application by non linear optimization methods 159
Equivalent circuit model of a bundle of cables for bulk current injection (BCI) test 155
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 155
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 152
Optimization Procedure for Removable EBG Common Mode Filter Design 150
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 149
Comparison of Data with Multiple Degrees of Freedom Utilizing the Feature Selective Validation (FSV) Method 147
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 146
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer 144
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 143
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 142
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 141
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 138
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 137
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 136
Feature selective validation (FSV) for validation of computational electromagnetics (CEM). Part I - The FSV method 135
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 134
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 134
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 134
Feature Selective Validation (FSV) for Validation of Computational Electromagnetics (CEM) – Part II: Assessment of FSV Performances 133
Two-Dimensional FDTD Analysis for Ionized Electromagnetic Fields 133
EMC Analysis of Axle Counters in the Italian Railway Network 133
Nonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling 133
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 132
Cavities’ Identification Algorithm for Power Integrity Analysis of Complex Boards 132
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 132
Internal stirring: an approach to approximate evaluation of shielding effectiveness of small slotted enclosures 132
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 132
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 132
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 131
De-embedding procedure based on computed/measured data set for PCB structures characterization 131
Impact of partial element accuracy on PEEC model stability 131
Resonant EBG-Based Common Mode Filter for LTCC Substrates 131
EMC characterization of SMPS devices: Circuit and radiated emissions model 130
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 130
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 130
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 129
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 129
An improved method of modeling lossy transmission lines in finite-difference, time-domain analysis 128
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 128
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 128
Lightning-induced effects on lossy MTL terminated on arbitrary loads: A wavelet approach 127
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 127
Reconfigurable photoinduced metamaterials in the microwave regime 126
Wide-band Lorentzian media in the FDTD algorithm 126
A multilayer removable EBG based common mode filter for high speed buses 126
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 125
Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation 125
3D Analysis for the Design Impact of Cover-Wall Join on enclosure’s Shielding Performances 124
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 123
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 123
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 123
Reconstruction of dispersive dielectric properties for PCB substrates using a genetic algorithm 123
Analytical integration of quasi-static potential integrals on nonorthogonal coplanar quadrilaterals for the PEEC method 122
Validation of a Three-Dimensional Transmission Line Matrix (TLM) Model Implementation of a Mode-Stirred Reverberation Chamber 122
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 122
Extension of the Unmatched-Media Time Reversal Method to Locate Soft Faults in Transmission Lines 122
Calculation of the Induced Effects due to a Lightning Stroke 121
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 121
Multipath Effects in Semi-Anechoic Chambers at Low Frequencies: A Simplified Prediction Model Based on Image Theory 121
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 120
Planar transmission line method for characterization of printed circuit board dielectrics 120
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 119
Practical EBG application to multilayer PCB: impact on power integrity 119
EMC Characterization of SMPS Devices: Circuit Model and Analysis of Radiated Emissions 119
Comparison of via equivalent circuit model accuracy using quasi-static and full-wave approaches 118
3D modelling and circuit model extraction of vias in multilayer Printed circuit boards 118
Validation of equivalent circuits extracted from S-parameter data for eye-pattern evaluation 118
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 118
A Preliminary Study of a Reverberation Chamber Method for Multiple Source Testing Using Intermodulation 117
Two Dimensional EBG Structures for Multiband Noise Mitigation 117
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 117
Attenuation by Lightning Protection System of Induced Voltages due to Direct Strikes to a Building 117
PEEC modeling of lightning protection systems and coupling to coaxial cables 116
Factors Influencing the Successful Validation of Transient Phenomenon Modelling 116
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 116
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 116
Constrained Decision Planning Applied to Field Profile Optimization in LPS of Structures Directly Struck by Lightning 115
Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling 115
EMI Due To Near Field in an Air-Insulated Substation 115
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 115
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 114
Comments on "Internal impedance of conductors of rectangular cross section" - Authors' reply 114
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 114
Systematic approach for the analysis of the electromagnetic environment inside a building during a lightning strike 114
Lightning Induced Transient Voltages in Presence of Complex Structures and Non-Linear Loads 113
PCB Interconnect Characterization from S-Parameters Measurements 113
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 113
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 113
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 113
Equivalent network synthesis for via holes discontinuities 113
Totale 13.499
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Categoria #
all - tutte 169.286
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 169.286
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/20221.663 0 0 234 82 97 12 77 161 123 85 155 637
2022/20236.835 484 208 110 570 761 727 18 433 3.205 38 172 109
2023/20241.635 505 103 72 281 98 350 27 78 6 35 13 67
2024/20256.031 74 138 906 156 616 494 850 560 1.383 160 362 332
2025/202610.839 471 1.182 541 1.186 807 976 2.123 410 1.315 903 745 180
2026/2027994 250 714 30 0 0 0 0 0 0 0 0 0
Totale 40.362