IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
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Continente #
NA - Nord America 3.830
EU - Europa 2.585
AS - Asia 1.103
OC - Oceania 19
Continente sconosciuto - Info sul continente non disponibili 9
SA - Sud America 3
AF - Africa 2
Totale 7.551
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Nazione #
US - Stati Uniti d'America 3.810
IE - Irlanda 1.020
CN - Cina 580
IT - Italia 408
TR - Turchia 401
DE - Germania 272
SE - Svezia 264
UA - Ucraina 222
GB - Regno Unito 178
FI - Finlandia 89
FR - Francia 69
IN - India 39
SG - Singapore 39
CA - Canada 18
AU - Australia 16
BE - Belgio 16
JP - Giappone 15
EU - Europa 8
RU - Federazione Russa 8
KR - Corea 7
RO - Romania 7
NL - Olanda 6
AT - Austria 5
TW - Taiwan 4
BD - Bangladesh 3
CH - Svizzera 3
CZ - Repubblica Ceca 3
ES - Italia 3
HK - Hong Kong 3
NZ - Nuova Zelanda 3
RS - Serbia 3
SA - Arabia Saudita 3
AE - Emirati Arabi Uniti 2
HR - Croazia 2
IQ - Iraq 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AR - Argentina 1
BA - Bosnia-Erzegovina 1
BR - Brasile 1
BY - Bielorussia 1
CL - Cile 1
CR - Costa Rica 1
GL - Groenlandia 1
GR - Grecia 1
HU - Ungheria 1
ID - Indonesia 1
KZ - Kazakistan 1
LU - Lussemburgo 1
MO - Macao, regione amministrativa speciale della Cina 1
NG - Nigeria 1
NP - Nepal 1
PH - Filippine 1
PL - Polonia 1
PT - Portogallo 1
SC - Seychelles 1
Totale 7.551
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Città #
Dublin 1.012
Jacksonville 907
Chandler 866
Izmir 218
Nanjing 162
Boardman 154
Wilmington 149
Lawrence 142
Princeton 141
New York 133
San Mateo 130
L’Aquila 110
L'aquila 96
Ann Arbor 83
Ashburn 77
Beijing 67
Nanchang 57
Shenyang 44
Seattle 39
Hebei 37
Milan 37
Woodbridge 37
Mountain View 36
Tianjin 32
Los Angeles 31
Verona 29
Kunming 26
Rome 26
Singapore 25
Jiaxing 24
Des Moines 21
Zhengzhou 20
Kitzingen 17
Brussels 16
Düsseldorf 15
Changsha 14
Jinan 14
Shanghai 14
Venezia 14
Norwalk 13
Tokyo 13
Dearborn 11
Houston 11
Ningbo 11
Hangzhou 10
Helsinki 10
San Francisco 9
Toronto 9
Changchun 7
Arezzo 6
Vasto 6
Cairo Montenotte 5
Cantalupo In Sabina 5
Grafing 5
Guangzhou 5
Melbourne 5
Pune 5
Vienna 5
Aquila 4
Berlin 4
Falls Church 4
Fremont 4
Lanzhou 4
Lappeenranta 4
Sakarya 4
Shenzhen 4
Taipei 4
Timisoara 4
Amsterdam 3
Belgrade 3
Canberra 3
Cervaro 3
Chieti 3
Fort Collins 3
Harbin 3
Hyderabad 3
London 3
Paris 3
Phoenix 3
Taizhou 3
Washington 3
Adapazarı 2
Alappuzha 2
Atlanta 2
Baghdad 2
Bremen 2
Brisbane 2
Carpineto Romano 2
Central 2
Chicago 2
Dallas 2
Dubai 2
Florence 2
Frankfurt am Main 2
Hefei 2
Madrid 2
Montesilvano Marina 2
Montréal 2
Moscow 2
Munich 2
Totale 5.340
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Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 182
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 120
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 111
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 101
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 99
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 93
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 86
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 85
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 82
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 81
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 79
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 78
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 78
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 78
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 78
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 76
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 76
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 75
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 75
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 74
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 74
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 73
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 73
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 73
Practical EBG application to multilayer PCB: impact on power integrity 72
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 71
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 69
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 69
Common Mode Filtering Performances of Planar EBG Structures 69
A multilayer removable EBG based common mode filter for high speed buses 69
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 67
Reconfigurable photoinduced metamaterials in the microwave regime 67
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 67
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 67
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 67
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 66
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 66
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 65
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 65
Optimization Procedure for Removable EBG Common Mode Filter Design 64
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 62
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 62
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 62
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 62
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 61
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics-Part II: Random Cylindrical Inclusions 61
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 61
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 60
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 60
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 60
Return via Connections for Extending Signal Link Path Bandwidth of Via Transitions 59
Probe Calibrations for Phased Array Measurement 59
Accurate and efficient analysis of planar electromagnetic band-gap structures for power bus noise mitigation in the GHz band 58
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 57
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 57
Electromagnetic Band Gap Structure for Common Mode Filtering of High Speed Differential Signals 57
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 56
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 56
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 55
Optimum Geometrical parameters for the EBG-Based Common Mode Filter Design 55
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 55
Effects of Time-Variant Non-Linear TSV Parameters on Transient Analysis for Signal Integrity 53
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 53
Non-Destructive Testing in Complexes Cabling Networks using Time Domain Reflectometry and Particle Swarm Optimization 53
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions 53
Near Field Shielding Performances of EMI Noise Suppression Absorbers 53
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 52
Resonant EBG-Based Common Mode Filter for LTCC Substrates 52
High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar 52
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 51
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 51
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties 51
Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV 51
Characterization of serial links at 5.5Gbps on FR4 backplanes 51
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 51
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 50
Fast physics-based via and trace models for signal and power integrity co-analysis 50
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 50
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 50
Sensitivity Analysis of Electromagnetic Transmission, Reflection and Absorption Coefficients for Biphasic Composite Structures 49
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 49
Impact of chip and interposer PDN to eye diagram in high speed channels 49
Signal Integrity Analysis of Embedded Planar EBG structures 48
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 48
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 48
Histogram density for the Feature Selective Validation (FSV) method 47
Synthesis of composite materials with conductive and/or lossy spherical inclusions 47
Standalone Removable EBG-Based Common Mode Filter for High Speed Differential Signaling 47
Link path design on a block-by-block basis 47
Electromagnetic Simulation of 3D stacked ICs: Full Model vs. S-parameter Cascaded Based Model 46
Investigating Confidence Histograms and Classification in FSV: Part I. Fuzzy FSV 46
Compact Configuration of a Planar EBG based CM Filter and Crosstalk Analysis 46
Mitigating the Threat of Crosstalk and Unwanted Radiation when using Electromagnetic Bandgap Structures to Suppress Common Mode Signal Propagation in PCB Differential Interconnects 46
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 46
Full-Wave EMC Simulations Using Maxwell-Garnett Model for Composites with Cylindrical Inclusions 45
Derivation of homogeneous permittivity of composite materials with aligned cylindrical inclusions for causal electromagnetic simulations 45
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 45
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 44
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 44
Impact of Planar Electromagnetic Band-gap Structures on IR-DROP and Signal Integrity in High Speed Printed Circuit Boards, 43
Totale 6.317
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Categoria #
all - tutte 32.203
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 32.203
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020941 185 0 108 2 3 118 176 4 115 89 17 124
2020/2021990 8 119 4 121 123 36 155 4 136 40 217 27
2021/2022746 32 45 109 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/202519 19 0 0 0 0 0 0 0 0 0 0 0
Totale 7.742