IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
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Continente #
NA - Nord America 7.016
EU - Europa 4.224
AS - Asia 4.068
SA - Sud America 497
AF - Africa 64
OC - Oceania 20
Continente sconosciuto - Info sul continente non disponibili 10
Totale 15.899
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Nazione #
US - Stati Uniti d'America 6.916
SG - Singapore 1.669
IE - Irlanda 1.043
CN - Cina 888
RU - Federazione Russa 843
IT - Italia 533
HK - Hong Kong 449
TR - Turchia 411
BR - Brasile 409
DE - Germania 356
VN - Vietnam 356
SE - Svezia 276
NL - Olanda 251
GB - Regno Unito 243
UA - Ucraina 229
FR - Francia 189
FI - Finlandia 128
IN - India 75
CA - Canada 59
JP - Giappone 47
AR - Argentina 37
MX - Messico 29
ZA - Sudafrica 26
BD - Bangladesh 25
PL - Polonia 25
IQ - Iraq 22
BE - Belgio 20
AT - Austria 17
AU - Australia 17
SA - Arabia Saudita 17
ES - Italia 16
EC - Ecuador 13
CO - Colombia 10
KR - Corea 10
CH - Svizzera 9
MA - Marocco 9
EU - Europa 8
PH - Filippine 8
PK - Pakistan 8
AZ - Azerbaigian 7
KE - Kenya 7
LT - Lituania 7
RO - Romania 7
TN - Tunisia 7
TW - Taiwan 7
CL - Cile 6
IL - Israele 6
JO - Giordania 6
KZ - Kazakistan 6
UY - Uruguay 6
OM - Oman 5
RS - Serbia 5
VE - Venezuela 5
AE - Emirati Arabi Uniti 4
CR - Costa Rica 4
DZ - Algeria 4
ID - Indonesia 4
IR - Iran 4
MY - Malesia 4
NP - Nepal 4
PY - Paraguay 4
BO - Bolivia 3
CZ - Repubblica Ceca 3
HR - Croazia 3
LB - Libano 3
NO - Norvegia 3
NZ - Nuova Zelanda 3
PE - Perù 3
QA - Qatar 3
SN - Senegal 3
UZ - Uzbekistan 3
AL - Albania 2
BA - Bosnia-Erzegovina 2
BH - Bahrain 2
EG - Egitto 2
GR - Grecia 2
JM - Giamaica 2
KH - Cambogia 2
LV - Lettonia 2
MD - Moldavia 2
PS - Palestinian Territory 2
PT - Portogallo 2
SY - Repubblica araba siriana 2
TH - Thailandia 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
BG - Bulgaria 1
BY - Bielorussia 1
CG - Congo 1
DM - Dominica 1
DO - Repubblica Dominicana 1
GE - Georgia 1
GH - Ghana 1
GL - Groenlandia 1
HN - Honduras 1
HU - Ungheria 1
IS - Islanda 1
KG - Kirghizistan 1
KW - Kuwait 1
Totale 15.887
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Città #
Dublin 1.035
Jacksonville 909
Chandler 866
Singapore 862
San Jose 729
Dallas 687
Hong Kong 442
Santa Clara 401
Ashburn 395
Boardman 318
Amsterdam 244
The Dalles 244
Izmir 218
Moscow 177
New York 176
Nanjing 164
Wilmington 149
L’Aquila 146
Lawrence 142
Princeton 141
San Mateo 130
Beijing 127
Ho Chi Minh City 119
L'aquila 96
Lauterbourg 90
Ann Arbor 83
Hanoi 80
Los Angeles 70
Nanchang 57
Columbus 53
Seattle 45
Naples 44
Shenyang 44
Milan 42
Rome 40
Tokyo 40
Hebei 37
Munich 37
Woodbridge 37
Mountain View 36
Tianjin 35
São Paulo 34
Frankfurt am Main 31
Helsinki 31
Verona 30
Montreal 27
Kunming 26
Hefei 25
Jiaxing 24
Shanghai 23
Des Moines 22
Zhengzhou 22
San Francisco 21
Brussels 20
Orem 20
Warsaw 20
Council Bluffs 18
Da Nang 18
Haiphong 17
Houston 17
Kitzingen 17
Johannesburg 16
Changsha 15
Chennai 15
Düsseldorf 15
Jinan 15
Poplar 15
Lappeenranta 14
Toronto 14
Venezia 14
Chicago 13
Norwalk 13
Phoenix 13
Baghdad 12
Manchester 12
Stockholm 12
Atlanta 11
Brooklyn 11
Dearborn 11
London 11
Ningbo 11
Rio de Janeiro 11
Belo Horizonte 10
Hangzhou 10
Can Tho 9
Charlotte 9
Curitiba 9
Riyadh 9
Vienna 9
Assago 8
Falkenstein 8
Mexico City 8
New Delhi 8
Turku 8
Baku 7
Changchun 7
Denver 7
Mumbai 7
Amman 6
Arezzo 6
Totale 10.669
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Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 222
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 192
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 155
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 152
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 149
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 147
Optimization Procedure for Removable EBG Common Mode Filter Design 144
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 140
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 138
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 137
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 134
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 133
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 133
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 131
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 130
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 129
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 129
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 128
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 128
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 126
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 126
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 124
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 124
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 122
Resonant EBG-Based Common Mode Filter for LTCC Substrates 122
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 121
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 120
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 120
Reconfigurable photoinduced metamaterials in the microwave regime 119
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 119
A multilayer removable EBG based common mode filter for high speed buses 119
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 119
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 118
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 117
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 116
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 116
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 115
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 115
Practical EBG application to multilayer PCB: impact on power integrity 114
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 114
Calibration loop antenna for 5G OTA measurement systems 114
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 112
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 112
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 111
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 111
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 109
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 108
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 108
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 107
Impact of chip and interposer PDN to eye diagram in high speed channels 107
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 107
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 106
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 106
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 106
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 106
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 105
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 105
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 105
A Truncation Scheme for the Analytical Formula of via Barrel-Plate Capacitance 104
An intelligent wire fault diagnosis approach using time domain reflectometry and pattern recognition network 104
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 102
Highly Integrated Wideband Transmit/Receive Module for X-Band SAR Applications 101
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 101
Common Mode Filtering Performances of Planar EBG Structures 101
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 101
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 101
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 100
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 100
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 99
Near Field Shielding Performances of EMI Noise Suppression Absorbers 99
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 98
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 98
Fast physics-based via and trace models for signal and power integrity co-analysis 98
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above 97
Application of an integrated RNN - ensemble method for the short-term forecast of inter-area oscillations modal parameters 96
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 94
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 94
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 94
Corrugated horn with stable phase center for Ka-band compact antenna test range measurement systems 94
System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors 93
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 93
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 93
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 91
System Level Cumulative EM Radiation Prediction From Stacked Machines in Data Centers 90
Probe Calibrations for Phased Array Measurement 90
Characterization of serial links at 5.5Gbps on FR4 backplanes 89
A Compact High-isolation Wideband Three-Sector Linear Array 89
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 88
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 88
Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV 88
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 88
Genetic Algorithm PDN Optimization based on Minimum Number of Decoupling Capacitors Applied to Arbitrary Target Impedance 88
Non-Contact In-Vehicle Occupant Monitoring System Based on Point Clouds from FMCW Radar 88
Enhancement of Short-Term prediction capabilities of Inter-Area Grid Oscillations with a Multi-Variate Ensemble-based Method. 88
Long-Term Reliability of PDN Design Based on Decap Aging and Temperature 87
Comparison of LSTM-Based Prediction Strategies for Grid Modal Parameters Forecast 87
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties 87
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics-Part II: Random Cylindrical Inclusions 87
High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar 87
Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer 87
Totale 11.144
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Categoria #
all - tutte 67.810
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 67.810
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021284 0 0 0 0 0 0 0 0 0 40 217 27
2021/2022746 32 45 109 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/20253.067 46 95 323 104 386 229 425 264 677 93 244 181
2025/20265.316 245 668 467 599 488 414 988 193 758 496 0 0
Totale 16.106