IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
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Continente #
NA - Nord America 7.687
EU - Europa 4.294
AS - Asia 4.205
SA - Sud America 525
Continente sconosciuto - Info sul continente non disponibili 221
AF - Africa 67
OC - Oceania 20
Totale 17.019
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Nazione #
US - Stati Uniti d'America 7.556
SG - Singapore 1.723
IE - Irlanda 1.043
CN - Cina 919
RU - Federazione Russa 847
IT - Italia 585
HK - Hong Kong 454
BR - Brasile 423
TR - Turchia 413
VN - Vietnam 359
DE - Germania 358
SE - Svezia 276
NL - Olanda 252
GB - Regno Unito 244
UA - Ucraina 230
FR - Francia 190
FI - Finlandia 128
IN - India 76
CA - Canada 75
JP - Giappone 67
AR - Argentina 39
BD - Bangladesh 39
MX - Messico 32
PL - Polonia 27
ZA - Sudafrica 27
IQ - Iraq 22
BE - Belgio 20
AT - Austria 17
AU - Australia 17
EC - Ecuador 17
ES - Italia 17
SA - Arabia Saudita 17
CO - Colombia 16
KR - Corea 11
CH - Svizzera 9
MA - Marocco 9
PH - Filippine 9
EU - Europa 8
PK - Pakistan 8
AE - Emirati Arabi Uniti 7
AZ - Azerbaigian 7
KE - Kenya 7
LT - Lituania 7
RO - Romania 7
TN - Tunisia 7
TW - Taiwan 7
CL - Cile 6
CR - Costa Rica 6
IL - Israele 6
JO - Giordania 6
KZ - Kazakistan 6
UY - Uruguay 6
MY - Malesia 5
OM - Oman 5
PE - Perù 5
RS - Serbia 5
VE - Venezuela 5
DZ - Algeria 4
ID - Indonesia 4
IR - Iran 4
NP - Nepal 4
PY - Paraguay 4
TT - Trinidad e Tobago 4
BO - Bolivia 3
CZ - Repubblica Ceca 3
GT - Guatemala 3
HR - Croazia 3
HU - Ungheria 3
JM - Giamaica 3
KH - Cambogia 3
LB - Libano 3
LV - Lettonia 3
NO - Norvegia 3
NZ - Nuova Zelanda 3
PT - Portogallo 3
QA - Qatar 3
SC - Seychelles 3
SN - Senegal 3
UZ - Uzbekistan 3
AL - Albania 2
BA - Bosnia-Erzegovina 2
BG - Bulgaria 2
BH - Bahrain 2
DM - Dominica 2
EG - Egitto 2
GR - Grecia 2
MD - Moldavia 2
PS - Palestinian Territory 2
SY - Repubblica araba siriana 2
TH - Thailandia 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
BY - Bielorussia 1
CG - Congo 1
DO - Repubblica Dominicana 1
GE - Georgia 1
GH - Ghana 1
GL - Groenlandia 1
HN - Honduras 1
Totale 16.793
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Città #
Dublin 1.035
Jacksonville 912
Singapore 872
Chandler 867
San Jose 859
Dallas 694
Ashburn 467
Hong Kong 446
Santa Clara 423
Boardman 318
Amsterdam 244
The Dalles 244
Izmir 218
New York 194
Council Bluffs 177
Moscow 177
Nanjing 164
L’Aquila 160
Wilmington 149
Lawrence 142
Princeton 141
Beijing 135
San Mateo 130
Ho Chi Minh City 119
L'aquila 96
Los Angeles 95
Lauterbourg 90
Ann Arbor 83
Hanoi 82
Nanchang 57
Columbus 53
Naples 48
Milan 47
Rome 47
Seattle 45
Shenyang 44
São Paulo 43
Tokyo 40
Woodbridge 38
Hebei 37
Munich 37
Mountain View 36
Tianjin 35
Montreal 32
Frankfurt am Main 31
Helsinki 31
Verona 30
Phoenix 29
Kunming 26
Hefei 25
San Francisco 25
Shanghai 25
Jiaxing 24
Orem 23
Zhengzhou 23
Des Moines 22
Brussels 20
Houston 20
Warsaw 20
Hokuto 19
Toronto 19
Da Nang 18
Haiphong 17
Johannesburg 17
Kitzingen 17
Atlanta 15
Changsha 15
Chennai 15
Chicago 15
Düsseldorf 15
Jinan 15
Poplar 15
Lappeenranta 14
Venezia 14
Brooklyn 13
Norwalk 13
Baghdad 12
London 12
Manchester 12
Rio de Janeiro 12
Stockholm 12
Charlotte 11
Dearborn 11
Hangzhou 11
Ningbo 11
Belo Horizonte 10
Mexico City 10
Can Tho 9
Curitiba 9
Denver 9
Riyadh 9
Vienna 9
Assago 8
Changchun 8
Falkenstein 8
New Delhi 8
Turku 8
Baku 7
Boston 7
Mumbai 7
Totale 11.242
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Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 226
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 197
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 161
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 154
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 152
Optimization Procedure for Removable EBG Common Mode Filter Design 150
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 149
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 146
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 143
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 142
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 141
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 138
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 137
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 136
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 134
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 134
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 134
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 132
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 132
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 131
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 131
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 130
Resonant EBG-Based Common Mode Filter for LTCC Substrates 130
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 129
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 129
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 129
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 128
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 128
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 127
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 127
Reconfigurable photoinduced metamaterials in the microwave regime 126
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 125
A multilayer removable EBG based common mode filter for high speed buses 125
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 123
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 123
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 122
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 122
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 121
Calibration loop antenna for 5G OTA measurement systems 120
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 119
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 119
Practical EBG application to multilayer PCB: impact on power integrity 119
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 118
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 117
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 116
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 116
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 114
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 114
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 114
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 113
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 113
Impact of chip and interposer PDN to eye diagram in high speed channels 113
An intelligent wire fault diagnosis approach using time domain reflectometry and pattern recognition network 113
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 112
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 112
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 111
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 111
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 110
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 110
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 110
Highly Integrated Wideband Transmit/Receive Module for X-Band SAR Applications 109
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 109
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 108
Near Field Shielding Performances of EMI Noise Suppression Absorbers 108
A Truncation Scheme for the Analytical Formula of via Barrel-Plate Capacitance 108
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 106
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 106
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 106
Common Mode Filtering Performances of Planar EBG Structures 106
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 106
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 106
Fast physics-based via and trace models for signal and power integrity co-analysis 104
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above 102
Corrugated horn with stable phase center for Ka-band compact antenna test range measurement systems 102
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 101
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 101
Enhancement of Short-Term prediction capabilities of Inter-Area Grid Oscillations with a Multi-Variate Ensemble-based Method. 101
Probe Calibrations for Phased Array Measurement 100
Application of an integrated RNN - ensemble method for the short-term forecast of inter-area oscillations modal parameters 99
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 99
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 98
System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors 97
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 97
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 97
System Level Cumulative EM Radiation Prediction From Stacked Machines in Data Centers 94
Comparison of LSTM-Based Prediction Strategies for Grid Modal Parameters Forecast 94
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 94
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 94
A Compact High-isolation Wideband Three-Sector Linear Array 94
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 93
Synthesis of composite materials with conductive and/or lossy spherical inclusions 93
High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar 93
Non-Contact In-Vehicle Occupant Monitoring System Based on Point Clouds from FMCW Radar 93
Characterization of serial links at 5.5Gbps on FR4 backplanes 92
Long-Term Reliability of PDN Design Based on Decap Aging and Temperature 91
Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV 91
Genetic Algorithm PDN Optimization based on Minimum Number of Decoupling Capacitors Applied to Arbitrary Target Impedance 91
Impact of decoupling capacitor aging and temperaturefor the long‑term reliability of power delivery networks 90
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 90
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties 90
Totale 11.711
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Categoria #
all - tutte 75.306
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 75.306
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022714 0 45 109 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/20253.067 46 95 323 104 386 229 425 264 677 93 244 181
2025/20265.786 245 668 467 599 488 414 988 193 758 590 322 54
2026/2027443 181 262 0 0 0 0 0 0 0 0 0 0
Totale 17.019