IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
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Continente #
NA - Nord America 5.937
AS - Asia 3.539
EU - Europa 3.370
SA - Sud America 465
AF - Africa 56
OC - Oceania 20
Continente sconosciuto - Info sul continente non disponibili 9
Totale 13.396
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Nazione #
US - Stati Uniti d'America 5.844
SG - Singapore 1.545
IE - Irlanda 1.024
CN - Cina 839
IT - Italia 509
HK - Hong Kong 423
TR - Turchia 410
RU - Federazione Russa 403
BR - Brasile 389
DE - Germania 335
SE - Svezia 276
GB - Regno Unito 232
UA - Ucraina 229
FI - Finlandia 124
FR - Francia 97
VN - Vietnam 85
IN - India 66
CA - Canada 56
JP - Giappone 36
AR - Argentina 34
ZA - Sudafrica 26
MX - Messico 25
PL - Polonia 25
IQ - Iraq 22
BD - Bangladesh 21
BE - Belgio 20
AT - Austria 17
AU - Australia 17
ES - Italia 14
NL - Olanda 14
EC - Ecuador 12
SA - Arabia Saudita 12
CH - Svizzera 9
MA - Marocco 9
EU - Europa 8
KR - Corea 8
LT - Lituania 7
PK - Pakistan 7
RO - Romania 7
CL - Cile 6
CO - Colombia 6
IL - Israele 6
JO - Giordania 6
KE - Kenya 6
KZ - Kazakistan 6
TW - Taiwan 6
AZ - Azerbaigian 5
OM - Oman 5
RS - Serbia 5
UY - Uruguay 5
VE - Venezuela 5
CR - Costa Rica 4
IR - Iran 4
NP - Nepal 4
TN - Tunisia 4
AE - Emirati Arabi Uniti 3
CZ - Repubblica Ceca 3
DZ - Algeria 3
HR - Croazia 3
NO - Norvegia 3
NZ - Nuova Zelanda 3
PY - Paraguay 3
QA - Qatar 3
UZ - Uzbekistan 3
BA - Bosnia-Erzegovina 2
BH - Bahrain 2
BO - Bolivia 2
EG - Egitto 2
GR - Grecia 2
ID - Indonesia 2
JM - Giamaica 2
LB - Libano 2
MD - Moldavia 2
PE - Perù 2
PS - Palestinian Territory 2
SN - Senegal 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AF - Afghanistan, Repubblica islamica di 1
AL - Albania 1
AM - Armenia 1
BG - Bulgaria 1
BY - Bielorussia 1
DM - Dominica 1
DO - Repubblica Dominicana 1
GL - Groenlandia 1
HN - Honduras 1
HU - Ungheria 1
LU - Lussemburgo 1
LV - Lettonia 1
MK - Macedonia 1
MO - Macao, regione amministrativa speciale della Cina 1
MU - Mauritius 1
NG - Nigeria 1
PH - Filippine 1
PR - Porto Rico 1
PT - Portogallo 1
SC - Seychelles 1
SR - Suriname 1
SY - Repubblica araba siriana 1
TJ - Tagikistan 1
Totale 13.394
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Città #
Dublin 1.016
Jacksonville 908
Chandler 866
Singapore 793
Dallas 685
Hong Kong 420
Santa Clara 383
Boardman 318
Ashburn 226
Izmir 218
New York 173
Nanjing 162
Wilmington 149
Lawrence 142
Princeton 141
L’Aquila 134
The Dalles 133
San Mateo 130
Beijing 118
Moscow 104
L'aquila 96
Ann Arbor 83
Los Angeles 69
Nanchang 57
Columbus 53
Seattle 45
Naples 44
Shenyang 44
Milan 42
Hebei 37
Munich 37
Woodbridge 37
Mountain View 36
Rome 35
Tianjin 35
São Paulo 34
Tokyo 33
Helsinki 31
Verona 30
Ho Chi Minh City 28
Kunming 26
Hefei 25
Montreal 25
Jiaxing 24
Zhengzhou 22
Des Moines 21
San Francisco 21
Shanghai 21
Brussels 20
Warsaw 20
San Jose 19
Houston 17
Kitzingen 17
Hanoi 16
Johannesburg 16
Changsha 15
Düsseldorf 15
Frankfurt am Main 15
Jinan 15
Orem 15
Poplar 15
Council Bluffs 14
Toronto 14
Venezia 14
Chennai 13
Norwalk 13
Baghdad 12
Phoenix 12
Stockholm 12
Brooklyn 11
Dearborn 11
London 11
Ningbo 11
Rio de Janeiro 11
Atlanta 10
Belo Horizonte 10
Chicago 10
Hangzhou 10
Lappeenranta 10
Amsterdam 9
Charlotte 9
Curitiba 9
Manchester 9
Vienna 9
Assago 8
Falkenstein 8
Riyadh 8
Turku 8
Changchun 7
Denver 7
Mexico City 7
Amman 6
Arezzo 6
Boston 6
Cape Town 6
Guangzhou 6
Haiphong 6
Mumbai 6
New Delhi 6
Vasto 6
Totale 8.886
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Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 209
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 155
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 145
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 138
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 132
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 127
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 122
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 121
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 120
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 114
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 114
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 111
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 111
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 111
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 111
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 109
Reconfigurable photoinduced metamaterials in the microwave regime 109
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 109
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 109
Optimization Procedure for Removable EBG Common Mode Filter Design 108
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 108
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 108
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 107
A multilayer removable EBG based common mode filter for high speed buses 106
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 106
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 106
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 105
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 105
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 104
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 103
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 103
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 102
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 102
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 101
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 100
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 100
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 98
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 98
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 97
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 97
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 97
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 97
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 96
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 95
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 95
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 95
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 94
Practical EBG application to multilayer PCB: impact on power integrity 94
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 94
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 94
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 93
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 93
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 92
Impact of chip and interposer PDN to eye diagram in high speed channels 92
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 92
Calibration loop antenna for 5G OTA measurement systems 92
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 91
Common Mode Filtering Performances of Planar EBG Structures 91
An intelligent wire fault diagnosis approach using time domain reflectometry and pattern recognition network 90
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 89
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 89
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 89
Near Field Shielding Performances of EMI Noise Suppression Absorbers 89
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 88
A Truncation Scheme for the Analytical Formula of via Barrel-Plate Capacitance 88
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 87
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 86
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 86
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 85
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 84
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 83
Resonant EBG-Based Common Mode Filter for LTCC Substrates 83
Probe Calibrations for Phased Array Measurement 83
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 82
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 81
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 81
Highly Integrated Wideband Transmit/Receive Module for X-Band SAR Applications 80
Fast physics-based via and trace models for signal and power integrity co-analysis 80
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 79
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics-Part II: Random Cylindrical Inclusions 79
Characterization of serial links at 5.5Gbps on FR4 backplanes 79
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above 79
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 78
Corrugated horn with stable phase center for Ka-band compact antenna test range measurement systems 78
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 77
Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV 77
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 77
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 77
Return via Connections for Extending Signal Link Path Bandwidth of Via Transitions 76
Application of an integrated RNN - ensemble method for the short-term forecast of inter-area oscillations modal parameters 74
Non-Destructive Testing in Complexes Cabling Networks using Time Domain Reflectometry and Particle Swarm Optimization 74
Full-Wave EMC Simulations Using Maxwell-Garnett Model for Composites with Cylindrical Inclusions 74
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions 74
Compact Configuration of a Planar EBG based CM Filter and Crosstalk Analysis 74
Link path design on a block-by-block basis 74
Sensitivity Analysis of Electromagnetic Transmission, Reflection and Absorption Coefficients for Biphasic Composite Structures 73
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties 73
Accurate and efficient analysis of planar electromagnetic band-gap structures for power bus noise mitigation in the GHz band 73
Standalone Removable EBG-Based Common Mode Filter for High Speed Differential Signaling 73
A Compact High-isolation Wideband Three-Sector Linear Array 73
Totale 9.596
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Categoria #
all - tutte 63.874
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 63.874
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021615 0 0 0 0 0 36 155 4 136 40 217 27
2021/2022746 32 45 109 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/20253.067 46 95 323 104 386 229 425 264 677 93 244 181
2025/20262.813 245 668 467 599 488 346 0 0 0 0 0 0
Totale 13.603