IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
NA - Nord America 8.888
EU - Europa 4.860
AS - Asia 4.232
SA - Sud America 546
Continente sconosciuto - Info sul continente non disponibili 223
AF - Africa 68
OC - Oceania 20
Totale 18.837
Salva come PNG Salva come JPEG
Nazione #
US - Stati Uniti d'America 8.656
SG - Singapore 1.727
IT - Italia 1.123
IE - Irlanda 1.043
CN - Cina 924
RU - Federazione Russa 849
HK - Hong Kong 454
BR - Brasile 438
TR - Turchia 413
VN - Vietnam 359
DE - Germania 358
SE - Svezia 276
GB - Regno Unito 257
NL - Olanda 253
UA - Ucraina 230
FR - Francia 191
CA - Canada 129
FI - Finlandia 129
JP - Giappone 77
IN - India 76
AR - Argentina 39
BD - Bangladesh 39
MX - Messico 34
PL - Polonia 27
ZA - Sudafrica 27
IQ - Iraq 22
BE - Belgio 20
EC - Ecuador 18
ES - Italia 18
AT - Austria 17
AU - Australia 17
CO - Colombia 17
SA - Arabia Saudita 17
CR - Costa Rica 14
PH - Filippine 12
KR - Corea 11
RO - Romania 10
TW - Taiwan 10
CH - Svizzera 9
MA - Marocco 9
EU - Europa 8
GT - Guatemala 8
IL - Israele 8
PK - Pakistan 8
VE - Venezuela 8
AE - Emirati Arabi Uniti 7
AZ - Azerbaigian 7
KE - Kenya 7
LT - Lituania 7
TN - Tunisia 7
TT - Trinidad e Tobago 7
CL - Cile 6
JM - Giamaica 6
JO - Giordania 6
KZ - Kazakistan 6
PE - Perù 6
SV - El Salvador 6
UY - Uruguay 6
HN - Honduras 5
MY - Malesia 5
NI - Nicaragua 5
OM - Oman 5
PR - Porto Rico 5
RS - Serbia 5
CZ - Repubblica Ceca 4
DZ - Algeria 4
EE - Estonia 4
ID - Indonesia 4
IR - Iran 4
NP - Nepal 4
PY - Paraguay 4
AL - Albania 3
BO - Bolivia 3
EG - Egitto 3
GP - Guadalupe 3
HR - Croazia 3
HU - Ungheria 3
KH - Cambogia 3
LB - Libano 3
LV - Lettonia 3
NO - Norvegia 3
NZ - Nuova Zelanda 3
PT - Portogallo 3
QA - Qatar 3
SC - Seychelles 3
SN - Senegal 3
UZ - Uzbekistan 3
BA - Bosnia-Erzegovina 2
BG - Bulgaria 2
BH - Bahrain 2
DM - Dominica 2
GR - Grecia 2
MD - Moldavia 2
PS - Palestinian Territory 2
SX - ???statistics.table.value.countryCode.SX??? 2
SY - Repubblica araba siriana 2
TH - Thailandia 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AF - Afghanistan, Repubblica islamica di 1
AG - Antigua e Barbuda 1
Totale 18.602
Salva come PNG Salva come JPEG
Città #
Dublin 1.035
San Jose 1.019
Jacksonville 914
Singapore 873
Chandler 867
Dallas 702
Ashburn 682
Hong Kong 446
Santa Clara 444
Council Bluffs 411
Boardman 318
Amsterdam 245
The Dalles 244
Izmir 218
New York 205
Moscow 177
Milan 164
Nanjing 164
L’Aquila 162
Wilmington 149
Lawrence 143
Princeton 141
Beijing 135
San Mateo 130
Ho Chi Minh City 119
Los Angeles 102
L'aquila 96
Rome 94
Lauterbourg 90
Ann Arbor 83
Hanoi 82
Naples 67
Nanchang 57
Columbus 54
Tokyo 50
Phoenix 46
Seattle 46
São Paulo 46
Shenyang 44
Woodbridge 38
Hebei 37
Montreal 37
Munich 37
Mountain View 36
Tianjin 35
Verona 34
Frankfurt am Main 31
Helsinki 31
Miano 29
Toronto 28
Shanghai 27
Chicago 26
Kunming 26
San Francisco 26
Hefei 25
Jiaxing 24
Orem 23
Zhengzhou 23
Des Moines 22
Houston 22
Atlanta 21
Brooklyn 21
Brussels 20
Warsaw 20
Hokuto 19
Da Nang 18
Denver 18
Haiphong 17
Johannesburg 17
Kitzingen 17
Florence 16
Changsha 15
Chennai 15
Düsseldorf 15
Jinan 15
Poplar 15
Charlotte 14
Lappeenranta 14
Norwalk 14
Venezia 14
London 13
North Bergen 13
Palermo 13
Washington 13
Baghdad 12
Bologna 12
Manchester 12
Rio de Janeiro 12
San José 12
Stockholm 12
Boston 11
Dearborn 11
Hangzhou 11
Ningbo 11
Turin 11
Belo Horizonte 10
Mexico City 10
Bari 9
Can Tho 9
Curitiba 9
Totale 12.242
Salva come PNG Salva come JPEG
Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 239
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 210
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 169
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 169
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 167
Optimization Procedure for Removable EBG Common Mode Filter Design 160
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 158
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 154
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 154
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 153
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 152
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 151
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 150
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 150
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 149
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 148
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 147
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 147
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 146
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 146
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 145
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 145
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 144
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 143
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 143
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 142
Resonant EBG-Based Common Mode Filter for LTCC Substrates 142
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 141
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 140
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 140
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 139
Calibration loop antenna for 5G OTA measurement systems 137
Reconfigurable photoinduced metamaterials in the microwave regime 135
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 135
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 135
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 133
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 132
A multilayer removable EBG based common mode filter for high speed buses 132
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 131
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 130
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 129
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 128
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 126
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 126
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 126
Practical EBG application to multilayer PCB: impact on power integrity 126
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 126
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 125
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 125
Impact of chip and interposer PDN to eye diagram in high speed channels 124
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 123
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 123
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 122
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 122
An intelligent wire fault diagnosis approach using time domain reflectometry and pattern recognition network 122
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 121
Near Field Shielding Performances of EMI Noise Suppression Absorbers 121
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 120
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 119
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 119
Highly Integrated Wideband Transmit/Receive Module for X-Band SAR Applications 118
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 118
Common Mode Filtering Performances of Planar EBG Structures 118
A Truncation Scheme for the Analytical Formula of via Barrel-Plate Capacitance 118
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 117
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 117
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 117
Application of an integrated RNN - ensemble method for the short-term forecast of inter-area oscillations modal parameters 114
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 114
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 114
Enhancement of Short-Term prediction capabilities of Inter-Area Grid Oscillations with a Multi-Variate Ensemble-based Method. 114
System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors 113
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 113
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 113
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 112
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 112
Fast physics-based via and trace models for signal and power integrity co-analysis 112
Corrugated horn with stable phase center for Ka-band compact antenna test range measurement systems 112
Probe Calibrations for Phased Array Measurement 111
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above 110
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 110
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 109
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 108
System Level Cumulative EM Radiation Prediction From Stacked Machines in Data Centers 106
Long-Term Reliability of PDN Design Based on Decap Aging and Temperature 106
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 106
Characterization of serial links at 5.5Gbps on FR4 backplanes 105
A Compact High-isolation Wideband Three-Sector Linear Array 105
Impact of decoupling capacitor aging and temperaturefor the long‑term reliability of power delivery networks 104
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 104
High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar 104
Bandwidth Limits of Connector Wipe Stub for Reliable 224 Gbps Signaling 103
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 103
Non-Contact In-Vehicle Occupant Monitoring System Based on Point Clouds from FMCW Radar 103
Comparison of LSTM-Based Prediction Strategies for Grid Modal Parameters Forecast 102
Return via Connections for Extending Signal Link Path Bandwidth of Via Transitions 102
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 102
Synthesis of composite materials with conductive and/or lossy spherical inclusions 102
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 101
Genetic Algorithm PDN Optimization based on Minimum Number of Decoupling Capacitors Applied to Arbitrary Target Impedance 100
Totale 12.828
Salva come PNG Salva come JPEG
Categoria #
all - tutte 80.387
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 80.387
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022560 0 0 0 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/20253.067 46 95 323 104 386 229 425 264 677 93 244 181
2025/20265.786 245 668 467 599 488 414 988 193 758 590 322 54
2026/20272.261 181 280 505 1.295 0 0 0 0 0 0 0 0
Totale 18.837