IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
NA - Nord America 7.397
EU - Europa 4.233
AS - Asia 4.133
SA - Sud America 500
AF - Africa 64
OC - Oceania 20
Continente sconosciuto - Info sul continente non disponibili 10
Totale 16.357
Salva come PNG Salva come JPEG
Nazione #
US - Stati Uniti d'America 7.291
SG - Singapore 1.702
IE - Irlanda 1.043
CN - Cina 906
RU - Federazione Russa 843
IT - Italia 538
HK - Hong Kong 453
TR - Turchia 411
BR - Brasile 410
VN - Vietnam 358
DE - Germania 356
SE - Svezia 276
NL - Olanda 251
GB - Regno Unito 243
UA - Ucraina 229
FR - Francia 189
FI - Finlandia 128
IN - India 75
CA - Canada 61
JP - Giappone 48
AR - Argentina 38
MX - Messico 30
BD - Bangladesh 28
PL - Polonia 27
ZA - Sudafrica 26
IQ - Iraq 22
BE - Belgio 20
AT - Austria 17
AU - Australia 17
SA - Arabia Saudita 17
ES - Italia 16
EC - Ecuador 13
KR - Corea 11
CO - Colombia 10
CH - Svizzera 9
MA - Marocco 9
PH - Filippine 9
EU - Europa 8
PK - Pakistan 8
AZ - Azerbaigian 7
KE - Kenya 7
LT - Lituania 7
RO - Romania 7
TN - Tunisia 7
TW - Taiwan 7
CL - Cile 6
IL - Israele 6
JO - Giordania 6
KZ - Kazakistan 6
UY - Uruguay 6
AE - Emirati Arabi Uniti 5
CR - Costa Rica 5
MY - Malesia 5
OM - Oman 5
RS - Serbia 5
VE - Venezuela 5
DZ - Algeria 4
ID - Indonesia 4
IR - Iran 4
NP - Nepal 4
PE - Perù 4
PY - Paraguay 4
BO - Bolivia 3
CZ - Repubblica Ceca 3
HR - Croazia 3
LB - Libano 3
NO - Norvegia 3
NZ - Nuova Zelanda 3
QA - Qatar 3
SN - Senegal 3
UZ - Uzbekistan 3
AL - Albania 2
BA - Bosnia-Erzegovina 2
BG - Bulgaria 2
BH - Bahrain 2
EG - Egitto 2
GR - Grecia 2
HU - Ungheria 2
JM - Giamaica 2
KH - Cambogia 2
LV - Lettonia 2
MD - Moldavia 2
PS - Palestinian Territory 2
PT - Portogallo 2
SY - Repubblica araba siriana 2
TH - Thailandia 2
TT - Trinidad e Tobago 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
BY - Bielorussia 1
CG - Congo 1
DM - Dominica 1
DO - Repubblica Dominicana 1
GE - Georgia 1
GH - Ghana 1
GL - Groenlandia 1
HN - Honduras 1
IS - Islanda 1
KG - Kirghizistan 1
Totale 16.344
Salva come PNG Salva come JPEG
Città #
Dublin 1.035
Jacksonville 911
Chandler 866
Singapore 866
San Jose 833
Dallas 690
Hong Kong 446
Ashburn 417
Santa Clara 408
Boardman 318
Amsterdam 244
The Dalles 244
Izmir 218
New York 185
Council Bluffs 177
Moscow 177
Nanjing 164
Wilmington 149
L’Aquila 146
Lawrence 142
Princeton 141
Beijing 132
San Mateo 130
Ho Chi Minh City 119
L'aquila 96
Lauterbourg 90
Ann Arbor 83
Hanoi 81
Los Angeles 80
Nanchang 57
Columbus 53
Naples 45
Seattle 45
Shenyang 44
Milan 42
Rome 41
Tokyo 40
Woodbridge 38
Hebei 37
Munich 37
Mountain View 36
São Paulo 35
Tianjin 35
Frankfurt am Main 31
Helsinki 31
Verona 30
Montreal 27
Kunming 26
Hefei 25
San Francisco 25
Jiaxing 24
Orem 23
Shanghai 23
Zhengzhou 23
Des Moines 22
Brussels 20
Warsaw 20
Houston 19
Da Nang 18
Haiphong 17
Kitzingen 17
Johannesburg 16
Changsha 15
Chennai 15
Chicago 15
Düsseldorf 15
Jinan 15
Poplar 15
Lappeenranta 14
Phoenix 14
Toronto 14
Venezia 14
Brooklyn 13
Norwalk 13
Atlanta 12
Baghdad 12
Manchester 12
Stockholm 12
Dearborn 11
London 11
Ningbo 11
Rio de Janeiro 11
Belo Horizonte 10
Charlotte 10
Hangzhou 10
Can Tho 9
Curitiba 9
Denver 9
Mexico City 9
Riyadh 9
Vienna 9
Assago 8
Changchun 8
Falkenstein 8
New Delhi 8
Turku 8
Baku 7
Mumbai 7
Amman 6
Arezzo 6
Totale 11.024
Salva come PNG Salva come JPEG
Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 225
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 196
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 160
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 153
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 150
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 149
Optimization Procedure for Removable EBG Common Mode Filter Design 145
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 145
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 141
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 139
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 137
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 136
EMI Minimization from Stacked Radiation Sources by Means of Multiple Objective Genetic Algorithm 135
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 134
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 133
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 132
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 131
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 130
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 129
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 129
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 129
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 127
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 127
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 126
Resonant EBG-Based Common Mode Filter for LTCC Substrates 126
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 126
Reconfigurable photoinduced metamaterials in the microwave regime 125
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 125
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 125
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 123
A multilayer removable EBG based common mode filter for high speed buses 122
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 122
Generalized Analytical Formulation for De-Embedding of Multiport Devices Based on Known Fixtures 121
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 121
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 121
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 119
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 118
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 117
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 117
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 117
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 116
Practical EBG application to multilayer PCB: impact on power integrity 116
Single‐step algorithm for the cascade assembly of multiple S‐parameters based multiports networks 116
Calibration loop antenna for 5G OTA measurement systems 115
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 113
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 112
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 112
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 111
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 111
Impact of chip and interposer PDN to eye diagram in high speed channels 110
An intelligent wire fault diagnosis approach using time domain reflectometry and pattern recognition network 110
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 110
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 109
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 109
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 109
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 108
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 108
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 108
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 108
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 107
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 107
A Truncation Scheme for the Analytical Formula of via Barrel-Plate Capacitance 106
Highly Integrated Wideband Transmit/Receive Module for X-Band SAR Applications 105
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 105
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 105
Near Field Shielding Performances of EMI Noise Suppression Absorbers 105
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 103
Common Mode Filtering Performances of Planar EBG Structures 103
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 102
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 101
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 101
Fast physics-based via and trace models for signal and power integrity co-analysis 100
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 99
Enhancement of Short-Term prediction capabilities of Inter-Area Grid Oscillations with a Multi-Variate Ensemble-based Method. 99
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 98
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above 98
Application of an integrated RNN - ensemble method for the short-term forecast of inter-area oscillations modal parameters 97
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 97
Corrugated horn with stable phase center for Ka-band compact antenna test range measurement systems 96
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 95
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 95
Probe Calibrations for Phased Array Measurement 95
Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry 95
System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors 93
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 93
System Level Cumulative EM Radiation Prediction From Stacked Machines in Data Centers 92
Comparison of LSTM-Based Prediction Strategies for Grid Modal Parameters Forecast 92
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 91
Characterization of serial links at 5.5Gbps on FR4 backplanes 91
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 90
Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV 90
Synthesis of composite materials with conductive and/or lossy spherical inclusions 90
Standalone Removable EBG-Based Common Mode Filter for High Speed Differential Signaling 90
A Compact High-isolation Wideband Three-Sector Linear Array 90
Long-Term Reliability of PDN Design Based on Decap Aging and Temperature 89
High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar 89
Genetic Algorithm PDN Optimization based on Minimum Number of Decoupling Capacitors Applied to Arbitrary Target Impedance 89
Non-Contact In-Vehicle Occupant Monitoring System Based on Point Clouds from FMCW Radar 89
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 88
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties 88
Totale 11.442
Salva come PNG Salva come JPEG
Categoria #
all - tutte 71.963
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 71.963
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202127 0 0 0 0 0 0 0 0 0 0 0 27
2021/2022746 32 45 109 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/20253.067 46 95 323 104 386 229 425 264 677 93 244 181
2025/20265.774 245 668 467 599 488 414 988 193 758 590 322 42
Totale 16.564