IRIS
DE PAULIS, FRANCESCO
 Distribuzione geografica
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Continente #
NA - Nord America 4.252
EU - Europa 2.600
AS - Asia 1.572
OC - Oceania 19
Continente sconosciuto - Info sul continente non disponibili 9
SA - Sud America 6
AF - Africa 3
Totale 8.461
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Nazione #
US - Stati Uniti d'America 4.232
IE - Irlanda 1.020
CN - Cina 616
SG - Singapore 461
IT - Italia 411
TR - Turchia 401
DE - Germania 278
SE - Svezia 264
UA - Ucraina 222
GB - Regno Unito 178
FI - Finlandia 92
FR - Francia 69
IN - India 43
CA - Canada 18
AU - Australia 16
BE - Belgio 16
JP - Giappone 15
EU - Europa 8
RU - Federazione Russa 8
AT - Austria 7
KR - Corea 7
RO - Romania 7
NL - Olanda 6
TW - Taiwan 6
BD - Bangladesh 4
HK - Hong Kong 4
BR - Brasile 3
CH - Svizzera 3
CZ - Repubblica Ceca 3
ES - Italia 3
NZ - Nuova Zelanda 3
RS - Serbia 3
SA - Arabia Saudita 3
AE - Emirati Arabi Uniti 2
HR - Croazia 2
IQ - Iraq 2
IR - Iran 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AR - Argentina 1
BA - Bosnia-Erzegovina 1
BY - Bielorussia 1
CL - Cile 1
CR - Costa Rica 1
GL - Groenlandia 1
GR - Grecia 1
HU - Ungheria 1
ID - Indonesia 1
KZ - Kazakistan 1
LU - Lussemburgo 1
MO - Macao, regione amministrativa speciale della Cina 1
NG - Nigeria 1
NO - Norvegia 1
NP - Nepal 1
OM - Oman 1
PH - Filippine 1
PL - Polonia 1
PT - Portogallo 1
SC - Seychelles 1
SN - Senegal 1
VE - Venezuela 1
Totale 8.461
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Città #
Dublin 1.012
Jacksonville 907
Chandler 866
Singapore 375
Boardman 318
Izmir 218
Santa Clara 198
Nanjing 162
Wilmington 149
Lawrence 142
Princeton 141
New York 133
San Mateo 130
L’Aquila 110
L'aquila 96
Ann Arbor 83
Ashburn 77
Beijing 67
Nanchang 57
Shenyang 44
Seattle 39
Hebei 37
Milan 37
Woodbridge 37
Mountain View 36
Tianjin 34
Los Angeles 31
Verona 29
Kunming 26
Rome 26
Jiaxing 24
Dallas 21
Des Moines 21
Zhengzhou 20
Shanghai 19
Kitzingen 17
Brussels 16
Düsseldorf 15
Jinan 15
Changsha 14
Venezia 14
Norwalk 13
Tokyo 13
Helsinki 12
Dearborn 11
Houston 11
Ningbo 11
Hangzhou 10
San Francisco 9
Toronto 9
Munich 8
Changchun 7
Arezzo 6
Vasto 6
Cairo Montenotte 5
Cantalupo In Sabina 5
Grafing 5
Guangzhou 5
Lappeenranta 5
Melbourne 5
Pune 5
Shenzhen 5
Vienna 5
Aquila 4
Berlin 4
Falls Church 4
Fremont 4
Lanzhou 4
Mumbai 4
Phoenix 4
Sakarya 4
Taipei 4
Timisoara 4
Amsterdam 3
Belgrade 3
Canberra 3
Cervaro 3
Chieti 3
Fort Collins 3
Harbin 3
Hyderabad 3
London 3
Paris 3
Taizhou 3
Washington 3
Adapazarı 2
Alappuzha 2
Atlanta 2
Baghdad 2
Bremen 2
Brisbane 2
Carpineto Romano 2
Central 2
Chicago 2
Dubai 2
Florence 2
Frankfurt am Main 2
Hefei 2
Madrid 2
Montesilvano Marina 2
Totale 6.090
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Nome #
A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards 188
Exploring Remote Monitoring of Degraded Compression and Bolted Joints in HV Power Transmission Lines 127
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis 117
Miniaturization of Common Mode Filter Based on EBG Patch Resonance 108
Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials 103
Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter 99
Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures 96
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias 92
Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-like Remote Monitoring 90
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 88
Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis 87
EBG-Based Common Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk 86
Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling 84
Through Silicon Via (TSV) Defect Modeling, Measurement and Analysis 83
Analytical Evalkuation of Scattering Parameters for Equivalent Circuit of a Through Silicon Via (TSV) Array 82
Analysis of Near Field Emissions from Common Mode Filters Based on EBG Structures 82
Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects 80
An Advanced Transmit/Receive 3D Ceramic Hybrid Circuit Module for Space Applications 80
Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures 79
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology 79
Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation 78
Impact of Frequency Dependent and Non-Linear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit 78
Reconfigurable photoinduced metamaterials in the microwave regime 78
Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm 78
Practical EBG application to multilayer PCB: impact on power integrity 77
Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology 77
Wire Fault Diagnosis Based on Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 77
A multilayer removable EBG based common mode filter for high speed buses 77
Dual-frequency Ku-band versatile phase locked loop synthesizer in LTCC mini-package for satellite applications 75
Novel De-embedding Metrology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer 75
Effective Noise Coupling Reduction in Metallic Enclosure Hosting X-K bands Microwave Circuits 75
Dynamically Reconfigurable Metamaterials for Shielding and Absorption in the GHz Range 74
Common Mode Filtering Performances of Planar EBG Structures 74
Removable EBG-based common-mode filter for high-speed signaling: Experimental validation of prototype design 73
Optimization Procedure for Removable EBG Common Mode Filter Design 73
TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via (TSV) Measurement Characterization 72
Through-silicon via capacitance-voltage hysteresis modeling for 2.5-D and 3-D IC 72
Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications 71
Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications 71
Identification of Intrinsic Discontinuities in High Voltage Transmission Lines for PLC Applications 71
Wire Fault Diagnosis Using Time-Domain Reflectometry and Backtracking Search Optimization Algorithm 70
Experimental Validation of Common-Mode Filtering Performances of Planar Electromagnetic Band-gap Structures 67
EBG-based common mode microstrip and stripline filters: experimental investigation of performances and crosstalk 67
Detection of Open and Short Faults in 3D-ICs based on Through Silicon Via (TSV) 67
Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems 67
Analytical Unit Cell Assembly for Efficient Chip/Package Power Distribution Network Modeling 66
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology 65
Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures 65
Impact of Shorting Vias Placement on Embedded Planar Electromagnetic Band-Gap Structures Within Multilayer Printed Circuit Boards 65
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics-Part II: Random Cylindrical Inclusions 65
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB 65
Diagnosis of Multiple Wiring Faults Using Time Domain Reflectometry and Teaching-Learning Based Optimization 64
Return via Connections for Extending Signal Link Path Bandwidth of Via Transitions 64
Three Dimensional Full Wave Validation of the Maxwell Granet to Debye Model Approach 63
Probe Calibrations for Phased Array Measurement 63
Accurate and efficient analysis of planar electromagnetic band-gap structures for power bus noise mitigation in the GHz band 62
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes 61
Performance Improvements of Wire Fault Diagnosis Approach Based on Time-Domain Reflectometry 61
Electromagnetic Band Gap Structure for Common Mode Filtering of High Speed Differential Signals 61
Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance 60
Optimum Geometrical parameters for the EBG-Based Common Mode Filter Design 59
Measurement of Differential Mode Propagation in Printed Circuit Board for Satellites Applications 59
Band-Gap Limits Prediction for Effective Noise Coupling Reduction in Microwave Circuits Metallic Enclosures 59
Near Field Shielding Performances of EMI Noise Suppression Absorbers 58
Remote Monitoring of Joints Status on In-Service High-Voltage Overhead Lines 58
Effects of Time-Variant Non-Linear TSV Parameters on Transient Analysis for Signal Integrity 57
Impact of Voltage Bias on through silicon Vias (TSV) Depletion and Crosstalk 57
Resonant EBG-Based Common Mode Filter for LTCC Substrates 57
High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar 57
Characterization of serial links at 5.5Gbps on FR4 backplanes 57
Metamaterials for Effective, Single Transmission Resonant Curves in the 1-5 THz Spectral Region 56
Non-Destructive Testing in Complexes Cabling Networks using Time Domain Reflectometry and Particle Swarm Optimization 56
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions 56
Fast physics-based via and trace models for signal and power integrity co-analysis 56
A Method for Measuring the Maximum Measurable Gain of a Passive Intermodulation Chamber 56
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz 56
Estimation of Modal Parameters for Inter-Area Oscillations Analysis by a Machine Learning Approach with Offline Training 56
Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines 55
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties 55
Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV 55
Single Step 2-Port Device De-Embedding Algorithm for Fixture-DUT-Fixture Network Assembly 55
Compact Configuration of a Planar EBG based CM Filter and Crosstalk Analysis 54
Derivation of homogeneous permittivity of composite materials with aligned cylindrical inclusions for causal electromagnetic simulations 54
Impact of chip and interposer PDN to eye diagram in high speed channels 54
Efficient estimation of EMI from stacked radiation sources by combining their spherical wave expansion coefficients 54
Signal Integrity Analysis of Embedded Planar EBG structures 53
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level 53
Sensitivity Analysis of Electromagnetic Transmission, Reflection and Absorption Coefficients for Biphasic Composite Structures 52
Synthesis of Composite Materials with Conductive Aligned Cylindrical Inclusions 52
Investigating Confidence Histograms and Classification in FSV: Part I. Fuzzy FSV 52
Full-Wave EMC Simulations Using Maxwell-Garnett Model for Composites with Cylindrical Inclusions 51
Synthesis of composite materials with conductive and/or lossy spherical inclusions 51
Standalone Removable EBG-Based Common Mode Filter for High Speed Differential Signaling 51
Link path design on a block-by-block basis 51
Histogram density for the Feature Selective Validation (FSV) method 50
Mitigating the Threat of Crosstalk and Unwanted Radiation when using Electromagnetic Bandgap Structures to Suppress Common Mode Signal Propagation in PCB Differential Interconnects 50
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above 50
Effective PCB Decoupling Optimization by Combining an Iterative Genetic Algorithm and Machine Learning 50
Electromagnetic Simulation of 3D stacked ICs: Full Model vs. S-parameter Cascaded Based Model 49
Decoupling capacitors placement at board level adopting a nature-inspired algorithm 49
Totale 6.884
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Categoria #
all - tutte 40.051
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 40.051
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020646 0 0 0 0 3 118 176 4 115 89 17 124
2020/2021990 8 119 4 121 123 36 155 4 136 40 217 27
2021/2022746 32 45 109 29 41 4 29 56 61 20 45 275
2022/20232.618 175 123 34 235 237 241 20 203 1.221 11 94 24
2023/2024765 176 53 30 78 70 187 14 49 3 33 12 60
2024/2025931 46 95 323 104 363 0 0 0 0 0 0 0
Totale 8.654